TFM-150-11-SM-D Allicdata Electronics
Allicdata Part #:

TFM-150-11-SM-D-ND

Manufacturer Part#:

TFM-150-11-SM-D

Price: $ 11.24
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .050 X .050 MICRO STRIPS
More Detail: Connector Header Through Hole 100 position 0.050" ...
DataSheet: TFM-150-11-SM-D datasheetTFM-150-11-SM-D Datasheet/PDF
Quantity: 1000
1 +: $ 10.11780
Stock 1000Can Ship Immediately
$ 11.24
Specifications
Operating Temperature: -55°C ~ 125°C
Insulation Height: 0.290" (7.37mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Liquid Crystal Polymer (LCP)
Features: --
Overall Contact Length: --
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Current Rating: 2.9A per Contact
Voltage Rating: 275VAC
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Number of Positions Loaded: All
Packaging: Tube 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Number of Positions: 100
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Series: Tiger Eye™ TFM
Style: Board to Board or Cable
Shrouding: Shrouded - 4 Wall
Mounting Type: Through Hole
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.139" (3.53mm)
Contact Length - Post: 0.080" (2.03mm)
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

TFM-150-11-SM-D, belongs to the family of rectangular connectors - headers, male pins. It is a standard pin size male header with 0.1” pitch and front face connection. It has 11 positions of contact pins with a consistent inter-pin distance of 0.1”. Additionally, contact retention is maintained through a positive locking system.

The TFM-150-11-SM-D connector is designed to be used in high-density applications. It is suitable for printed circuit boards (PCBs) with a 0.040” or 1.02mm thickness. The tape and reel packaging allows fast and efficient assembly of the connectors.

TFM-150-11-SM-D connectors play an important role in applications like mobile phones, automotive communications, telecommunications, and consumer electronics. Equipped with features such as ease of use, good conductivity, minimal contact resistance, and self-aligning, these connectors are highly preferred in a variety of industries.

If you are looking for an efficient, reliable and reliable way to connect two electronic devices then the TFM-150-11-SM-D connector is the answer. It consists of a plastic insulator with a metal header and is designed to not only connect but also protect against interference from other signals on the circuit board.

The working principle of the TFM-150-11-SM-D is fairly simple. It consists of two parts – a header and an insulator. The header is made up of a metal such as steel or copper and it has pins sticking out of one end. These pins are aligned in a specific spacing that matches the requirements of the application. The other end of the header is equipped with a locking mechanism that helps to ensure that the header is secure when inserted into the insulator.

When the header is inserted into the insulator, it locks in place thanks to the locking mechanism and the contacts at the end of the pins come into contact with the contact points inside the insulator. This creates an electrical connection, providing the required electrical signal for the application.

The TFM-150-11-SM-D connector is a perfect choice for applications demanding a small form factor with exceptional signal integrity. It can be used in a variety of industrial, automotive, and consumer applications. Its design ensures that it has a long life and is durable enough to withstand rugged conditions. Furthermore, its easy-to-use and easy-to-install design makes it a great choice for those looking for a hassle-free, reliable connection.

The specific data is subject to PDF, and the above content is for reference

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