Allicdata Part #: | TFM-150-23-S-D-A-ND |
Manufacturer Part#: |
TFM-150-23-S-D-A |
Price: | $ 11.87 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Samtec Inc. |
Short Description: | .050 X .050 MICRO STRIPS |
More Detail: | Connector Header Through Hole 100 position 0.050" ... |
DataSheet: | TFM-150-23-S-D-A Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 10.67850 |
Operating Temperature: | -55°C ~ 125°C |
Insulation Height: | 0.360" (9.14mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Post: | Tin |
Contact Material: | Phosphor Bronze |
Insulation Material: | Liquid Crystal Polymer (LCP) |
Features: | Board Guide |
Overall Contact Length: | -- |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Black |
Current Rating: | 2.9A per Contact |
Voltage Rating: | 275VAC |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | -- |
Applications: | -- |
Number of Positions Loaded: | All |
Packaging: | Tube |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.050" (1.27mm) |
Number of Positions: | 100 |
Number of Rows: | 2 |
Row Spacing - Mating: | 0.050" (1.27mm) |
Series: | Tiger Eye™ TFM |
Style: | Board to Board or Cable |
Shrouding: | Shrouded - 4 Wall |
Mounting Type: | Through Hole |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.139" (3.53mm) |
Contact Length - Post: | 0.111" (2.82mm) |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The TFM-150-23-S-D-A is a type of rectangular connector used in a variety of applications ranging from telecommunications to consumer electronics. It is a header, male pin, surface mount connector with a dual row, 23 pin configuration and a top-mounted shield. The primary purpose of this connector is to provide a secure, reliable electrical connection between two or more boards or components.
This connector is typically used in applications with relatively high power or higher voltage requirements, such as automotive, telecommunications, industrial automation, and consumer electronics. It is particularly effective in applications where space is limited, since it has a compact design and low profile. It is also used to reduce wire complexity and eliminate the need for crimping or soldering. Additionally, it is designed to withstand harsh environmental conditions such as vibration, shock, extreme temperatures, and dust.
The TFM-150-23-S-D-A consists of two separate connectors that are strongly attached to each other. The first connector is the header, which is a stationary part that is usually permanently mounted on the main board or other suitable surface. The second connector is the male pin, which is made up of an array of metal pins that make the electrical connection with the header when assembled. The two parts of the connector are held together with a snap-lock connector. The TFM-150-23-S-D-A can accommodate a wide variety of wire sizes and is rated up to 150V.
The working principle of the TFM-150-23-S-D-A involves two primary components: the header and the male pins. The header consists of a PCB with metal contacts embedded in it. These contacts are designed to make contact with the male pins when the two parts are assembled. The male pins are arranged in a spaced dual row along a socket strip that lines up with the header’s contacts. When the two parts of the connector are connected, the electrical connection is completed, allowing current to flow between the two components.
In conclusion, the TFM-150-23-S-D-A header, male pin, surface mount connector is an ideal choice for applications with space or power limitations. Its two-pin dual row configuration makes it an effective solution for connecting multiple boards or components, and its snap-lock design ensures a secure and reliable connection. The connector is rated for up to 150V and is designed to withstand harsh environmental conditions.
The specific data is subject to PDF, and the above content is for reference
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