TSM-104-01-TM-SV-P Allicdata Electronics
Allicdata Part #:

TSM-104-01-TM-SV-P-ND

Manufacturer Part#:

TSM-104-01-TM-SV-P

Price: $ 0.60
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .025 SQ. TERMINAL STRIPS
More Detail: Connector Header Surface Mount 4 position 0.100" (...
DataSheet: TSM-104-01-TM-SV-P datasheetTSM-104-01-TM-SV-P Datasheet/PDF
Quantity: 1000
1 +: 0.60000
Stock 1000Can Ship Immediately
$ 0.6
Specifications
Termination: Solder
Operating Temperature: -55°C ~ 105°C
Features: Pick and Place
Insulation Material: Liquid Crystal Polymer (LCP)
Contact Material: Phosphor Bronze
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: --
Contact Finish - Mating: Tin
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Overall Contact Length: --
Contact Length - Post: --
Contact Length - Mating: 0.230" (5.84mm)
Fastening Type: Push-Pull
Series: TSM
Mounting Type: Surface Mount
Shrouding: Unshrouded
Style: Board to Board or Cable
Number of Positions Loaded: All
Row Spacing - Mating: --
Number of Rows: 1
Number of Positions: 4
Pitch - Mating: 0.100" (2.54mm)
Contact Type: Male Pin
Connector Type: Header
Part Status: Active
Packaging: Tube 
Description

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The TSM-104-01-TM-SV-P is a type of rectangular connector, specifically categorized as a header with male pins. As the name implies, this is a component with an especially long pin geometry that allows for many variations of connection points. The pin geometry ensures strong electrical and mechanical contact with other compatible devices, making it a preferred product for a wide range of applications.

The TSM-104-01-TM-SV-P is well-suited for use in various types of electronic and electrical applications. This includes applications such as industrial, automotive, consumer, telecommunication, and computer applications. This versatile piece of equipment is also very popular in medical electronics, as well as in high speed and low speed systems.

The working principle of the TSM-104-01-TMS-V-P is relatively simple but extremely effective. It is based on the well-known and tested principle of current and voltage interaction, where a closed-circuit connection exists between two terminals in order to maintain a uniformly controlled current flow. This current flow is then used to power specific functions, depending on the application.

The form factor made possible by the TSM-104-01-TM-SV-P is very varied, due both its complex pin geometry and its robust design. As mentioned earlier, this popular piece of equipment is available in two different form factors—surface mount and through-hole mounting. The surface mount option utilizes a number of small interconnected metal pins, placed directly on the surface of the board. This ensures that the component is firmly secured and that its contacts remain sterile throughout its usage.

The through-hole mounting format of the TSM-104-01-TM-SV-P utilizes a single set of pins that are inserted directly into the board. This provides more stability for the component and ensures that the contact points remain secure and free from dirt and other contaminants. In addition, through-hole mounting also allows for hotter solder joints, improved thermal performance, as well as greater plated thickness tolerance.

The TSM-104-01-TM-SV-P is a reliable and convenient component for a variety of applications. It has a proven track record of proven performance, offering users a superior connection, strong electrical and mechanical contact, and versatility across a wide range of applications. Its long pin geometry allows for intricate configurations of connections levels and further provides users with a great range of options for their applications. The device is available in two different form factors as mentioned above and, due to its excellent performance, is ideal for demanding applications.

The specific data is subject to PDF, and the above content is for reference

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