
Allicdata Part #: | TSM-105-03-T-DV-A-P-ND |
Manufacturer Part#: |
TSM-105-03-T-DV-A-P |
Price: | $ 1.25 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Samtec Inc. |
Short Description: | .025 SQ. TERMINAL STRIPS |
More Detail: | Connector Header Surface Mount 10 position 0.100" ... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 1.12140 |
Operating Temperature: | -55°C ~ 105°C |
Insulation Height: | 0.100" (2.54mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Tin |
Contact Finish Thickness - Mating: | -- |
Contact Finish - Post: | Tin |
Contact Material: | Phosphor Bronze |
Insulation Material: | Liquid Crystal Polymer (LCP) |
Features: | Board Guide, Pick and Place |
Overall Contact Length: | -- |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Black |
Current Rating: | -- |
Voltage Rating: | -- |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | -- |
Applications: | -- |
Number of Positions Loaded: | All |
Packaging: | Tube |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 10 |
Number of Rows: | 2 |
Row Spacing - Mating: | 0.100" (2.54mm) |
Series: | TSM |
Style: | Board to Board or Cable |
Shrouding: | Unshrouded |
Mounting Type: | Surface Mount |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.420" (10.67mm) |
Contact Length - Post: | -- |
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The TSM-105-03-T-DV-A-P is a kind of Rectangular Connectors - Headers, Male Pins, which are widely used in the electronics industry. It is designed for power and signal application and can be used in many industrial devices. The header can be used on different levels of circuit board, and its connection structure is reliable and can be used in either vertical or horizontal direction.
The advantages of the TSM-105-03-T-DV-A-P can be summarized in the following points.
Application Field
The TSM-105-03-T-DV-A-P is a connector suitable for industrial applications. Specifically, it can be used for digital and electronic systems like internet devices, communication equipment, backbone networks, data storage systems, computer peripherals, fueling systems, electrical monitoring systems, HAVC systems, and industrial automation systems. It is also able to connect devices relating to power, air-conditioning, pumps, fire control, motors, and ground navigation systems. Additionally, it can be used in smart homes and buildings for lighting, decoration, door control, security, and other indoor applications. It provides reliable, high-performance, and secure connections for these systems. Furthermore, its resistance to corrosion and oxidation helps to maintain long-term functionality.
Working Principle
The TSM-105-03-T-DV-A-P working principle has three main components. First, it has low contact resistance. This enables fast and reliable signal transmission amongst connected ports. Second, it has efficient heat management capabilities. This feature ensures that the temperature of the TSM-105-03-T-DV-A-P does not rise too high at any point during operation. Finally, the TSM-105-03-T-DV-A-P has high pressure terminal connection technology. This makes sure that the connection is secure and firm so that it can handle larger current transmission.
The TSM-105-03-T-DV-A-P has built-in insulation, which is designed to keep out dampness and dust. This helps to reduce maintenance costs and noise emissions. The simple structure makes it easy to use for people in different levels of expertise. As such, it is safe and reliable to use for electric connections.
Conclusion
The TSM-105-03-T-DV-A-P is designed for power and signal application in many electronics applications. Its low contact resistance, efficient heat management capabilities, and high pressure terminal connection technology all work together to make this connector a reliable and secure option. Furthermore, its simple structure and insulation capabilities make it an easy and safe option for different types of users.
The specific data is subject to PDF, and the above content is for reference
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