TSM-108-01-L-DV-A-P

Operating Temperature:	-55°C ~ 125°C
Insulation Height:	0.100" (2.54mm)
Contact Shape:	Square
Contact Finish - Mating:	Gold
Contact Finish Thickness - Mating:	10.0µin (0.25µm)
Contact Finish - Post:	Tin
Contact Material:	Phosphor Bronze
Insulation Material:	Liquid Crystal Polymer (LCP)
Features:	Board Guide, Pick and Place
Overall Contact Length:	--
Ingress Protection:	--
Material Flammability Rating:	UL94 V-0
Insulation Color:	Black
Current Rating:	--
Voltage Rating:	--
Mated Stacking Heights:	--
Contact Finish Thickness - Post:	--
Applications:	--
Number of Positions Loaded:	All
Packaging:	Tube
Part Status:	Active
Connector Type:	Header
Contact Type:	Male Pin
Pitch - Mating:	0.100" (2.54mm)
Number of Positions:	16
Number of Rows:	2
Row Spacing - Mating:	0.100" (2.54mm)
Series:	TSM
Style:	Board to Board or Cable
Shrouding:	Unshrouded
Mounting Type:	Surface Mount
Termination:	Solder
Fastening Type:	Push-Pull
Contact Length - Mating:	0.230" (5.84mm)
Contact Length - Post:	--

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TSM-108-01-L-DV-A-P Application Field and Working Principle

TSM-108-01-L-DV-A-P, manufactured by Amphenol, is one of the most commonly used rectangular connectors—headers, male pins. It is mainly used in various electronic and industrial application fields, such as automotive electronics, medical devices, consumer electronics, telecommunication systems, test and measurement equipment, power electronics, renewable energy systems, etc. Thanks to its versatile characteristics, the TSM-108-01-L-DV-A-P is widely used to perform the most important functions—terminating and transferring of signals, and providing a reliable and secure connection.

Features of TSM-108-01-L-DV-A-P

TSM-108-01-L-DV-A-P is specially designed to provide a reliable and secure connection between electronic circuits. It is available in multiple form factors— lead free, right angle, and angle-independent mounting possibilities—which allow customers to select the right TSM-108-01-L-DV-A-P for their application. The TSM-108-01-L-DV-A-P complies with strict environmental requirements, as well as performance requirements for RoHS and REACH standards. Additionally, it also provides a reliable contact between mating surfaces, superior mating force, and anti-corrosive gold plated electrical contacts that are optimized for a wide variety of industrial applications.

Working Principle of TSM-108-01-L-DV-A-P

The onboard contact module of a TSM-108-01-L-DV-A-P is an insulated counterpart to the PCB contact module in a 3.00mm pitch format. The connection between the two modules is made via a row of mating pins which make electrical connection while the pins are in contact. The connection is secured with a selection of latching clips, either standard or lock-in variants, depending on the application requirements. The contribution of latching clips to the connection stability is significant. When connected, the latching clips create a secure mechanical bond between the interface of the two component modules and are designed to build an electrical connection over a long period of time. When the pins of the contact module and PCB are connected, the latching clip of the connector is then pushed down over the shape of the pins, creating a secure connection. This enables the connection to provide extra electrical and mechanical stability, whilst also protecting the pins of the connectors from damage. Additionally, the pins of the TSM-108-01-L-DV-A-P are plated with a gold finish, which creates an low-resistance contact between the two terminations and helps prevent oxidation over time.

Conclusion

The TSM-108-01-L-DV-A-P is an industry-leading rectangular connector—headers, male pins which is designed to provide a reliable and secure connection between electronic circuits in a variety of industrial and consumer applications. Thanks to its versatile characteristics, the TSM-108-01-L-DV-A-P has the ability to perform the most important connection functions—terminating and transferring of signals. Additionally, it also provides superior mating force and anti-corroding electrical contacts that are optimized for a variety of fields. Finally, the secure, durable and low-resistance connection created by the TSM-108-01-L-DV-A-P when connected ensures the reliable transmission of signals in any application.

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