TSM-110-01-S-DH

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TSM-110-01-S-DH is part of the rectangular connector family from leading manufacturer Samtec. This family of rectangular connectors is categorized as headers, male pins, and performs essential functions in a variety of applications, from providing enhanced connectivity to active mechanically secure and reliable solutions.

The TSM-110-01-S-DH connector is a 1.27mm pitch, 110-position, surface mount, side stackable header. The header is deigned with characteristics to facilitate automated assembly, making it ideal for high-density electronic applications, such as in data communications systems, office automation equipment, networking systems, and test and measurement equipment. The key construction features of this family of connectors enable them to function with reliable performance over extended periods of time in highly demanding and rugged environments.

The TSM-110-01-S-DH connects two electronic modules together with a reliable interconnecting bridge. This bridge can be used for signaling information, allowing for the delivery or reception of data between the two modules. The header uses an mated overmold system, which means that both housings are mechanically secure when mated and sealed. In addition to greater durability, this also prevents potential damage to external equipment from static electricity.

The TSM-110-01-S-DH utilizes a high-reliability contact system that is capable of handling up to 6A of current. It is low-power capable, which is helpful in noise reduction applications. The mated height of the profile is 7.7mm, and it has a pin count density of 1,000 pins per cubic inch or greater.

The TSM-110-01-S-DH is also RoHS (Restriction of Hazardous Substances) complaint. This compliance helps ensure that the connector does not contain hazardous materials such as lead, cadmium, mercury or hexavalent chromium.

The TSM-110-01-S-DH is designed to meet the demands of applications in a variety of industries. Its contact system is capable of handling high-speed signals, its mated-overmold design provides superior performance and reliability, and its RoHS compliance ensures that it meets safety standards. Its easy assembly and low profile enable it to be used in applications ranging from consumer electronics and office automation equipment to network equipment and medical imaging.

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