TSM-113-01-L-SH-LC-013 Allicdata Electronics
Allicdata Part #:

TSM-113-01-L-SH-LC-013-ND

Manufacturer Part#:

TSM-113-01-L-SH-LC-013

Price: $ 1.96
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .025 SQ. TERMINAL STRIPS
More Detail: Connector Header Surface Mount, Right Angle 13 pos...
DataSheet: TSM-113-01-L-SH-LC-013 datasheetTSM-113-01-L-SH-LC-013 Datasheet/PDF
Quantity: 1000
1 +: $ 1.76400
Stock 1000Can Ship Immediately
$ 1.96
Specifications
Operating Temperature: -55°C ~ 125°C
Insulation Height: 0.120" (3.05mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Liquid Crystal Polymer (LCP)
Features: Board Lock
Overall Contact Length: --
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Number of Positions Loaded: 12
Packaging: Tube 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 13
Number of Rows: 1
Row Spacing - Mating: --
Series: TSM
Style: Board to Board or Cable
Shrouding: Unshrouded
Mounting Type: Surface Mount, Right Angle
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.230" (5.84mm)
Contact Length - Post: --
Description

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Rectangular Connectors - Headers, Male Pins are ideal for electrical connections between electronic components, circuit boards, cables, and other systems. The TSM-113-01-L-SH-LC-013 is a product in this product line. This article will review the application field and working principle of the TSM-113-01-L-SH-LC-013.

Application Field

The TSM-113-01-L-SH-LC-013 is a high-performance, 26-position, 0.1-inch header. It is designed with a low-profile, low insertion-force connector, which is ideal for small, space constrained circuits and designs. It is ideal for applications with board-to-board, cable-to-board, and mezzanine-style connections. The TSM-113-01-L-SH-LC-013 features a secure and reliable latching mechanism which ensures the connections remain secure. The connector is RoHS compliant and is suitable for a wide range of power- and signal-level applications.

Working Principle

The TSM-113-01-L-SH-LC-013 utilizes a latching mechanism to ensure secure connections. The latching mechanism consists of two components: the latch bar and the latch hook. The latch bar is a recessed slot on one side of the connector, while the latch hook is a protruding lip on the opposite side of the connector. When the connector is mated, the latch hook slides in the latch bar and locks in place. This ensures that the connection is secure and won\'t be accidentally disengaged.

The TSM-113-01-L-SH-LC-013 header is also designed with an anti-skid feature. This feature prevents the connector from slipping while the latch bar and latch hook are engaged. The header also features an integral retention feature, which helps to minimize noise in high-speed applications.

The TSM-113-01-L-SH-LC-013 is designed with an anti-backout feature. This feature prevents the connector from loosening during installation or removal. The anti-backout feature is also designed to reduce cable vibration in applications with continuous movement.

The TSM-113-01-L-SH-LC-013 is also designed with an IP67 protection rating. This feature ensures that dust and water are kept out of the connector during operation. Additionally, the connector has a UL 94V-0 flame rating and is suitable for use in a wide range of temperatures.

The TSM-113-01-L-SH-LC-013 is a high-performance, low-profile header ideal for small, space constrained circuits and boards. It utilizes a secure and reliable latching mechanism, an anti-skid feature, an integral retention feature, and an anti-backout feature to ensure reliable connections. Additionally, the header has an IP67 protection rating and is UL 94V-0 flame rated.

The specific data is subject to PDF, and the above content is for reference

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