TSM-113-02-L-DV-A Allicdata Electronics
Allicdata Part #:

TSM-113-02-L-DV-A-ND

Manufacturer Part#:

TSM-113-02-L-DV-A

Price: $ 2.19
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .025 SQ. TERMINAL STRIPS
More Detail: Connector Header Surface Mount 26 position 0.100" ...
DataSheet: TSM-113-02-L-DV-A datasheetTSM-113-02-L-DV-A Datasheet/PDF
Quantity: 1000
1 +: $ 1.97190
Stock 1000Can Ship Immediately
$ 2.19
Specifications
Operating Temperature: -55°C ~ 125°C
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Liquid Crystal Polymer (LCP)
Features: Board Guide
Overall Contact Length: --
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Number of Positions Loaded: All
Packaging: Tube 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 26
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Series: TSM
Style: Board to Board or Cable
Shrouding: Unshrouded
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.320" (8.13mm)
Contact Length - Post: --
Description

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Rectangular Connectors - Headers, Male Pins are the main components of electrical and electronic components’ interconnection. As an important part of them, TSM-113-02-L-DV-A plays an important role in the interconnected systems. It is widely used in the fields of automotive, military, aerospace, and communication. This article will mainly introduce the application field and working principle of TSM-113-02-L-DV-A.

Generally, TSM-113-02-L-DV-A is a 2 rows (totaling 113) low profile (sitting only 6.2mm from the PCB surface) version of a 2mm pitch, 3 pins SMT or through hole miniature female/male connector system with 4.11mm centerline spacing. Allowing a low packing design for any board-to-board interconnection. It can be fabricated with a variety of materials in order to meet all kinds of requirements.

TSM-113-02-L-DV-A has a wide range of application fields. It is the most common choice for automotive components requirements. Its vibration-proof design makes it suitable for any auto field. Not only is it widely used in passenger vehicles, but also in commercial vehicles, like trucks. Besides, it is also used in military and aerospace applications. Its metal shell design and advanced locking system make it an ideal choice for harsh environment. In addition, TSM-113-02-L-DV-A also applies in the area of communication, especially in the fields of radio and optical communication. It is able to perform well in these high frequency communication fields. Its special design also makes it an ideal choice for audio/video applications.

The working principle of TSM-113-02-L-DV-A is that the conductive band in the connector is used as the contact. When the two connectors are connected together, the spring in the connector will produce an attractive force, which ensures that the two connectors stay tightly together. At that time, the conductive band of the two connectors makes good contact with each other, thus achieving the purpose of signal transmission. TSM-113-02-L-DV-A is available in a variety of configurations to suit any application, including SMT, stamp hole, right angle and dual contact configurations.

To sum up, TSM-113-02-L-DV-A is a versatile 2 rows 113 pitch connectors system. It has a wide range of applications, including automotive, military, aerospace, communication and audio/video. Its vibration-proof design and metal shell protection can make it perfectly perform even in harsh environment. In addition, its special design and advanced locking system also makes it an ideal choice for high frequency communication fields. Its attractive force can keep the connectors tightly connected, ensuring good contact between the conductive bands and successful signal transmission.

The specific data is subject to PDF, and the above content is for reference

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