TSM-116-03-L-DV-P-TR Allicdata Electronics
Allicdata Part #:

TSM-116-03-L-DV-P-TR-ND

Manufacturer Part#:

TSM-116-03-L-DV-P-TR

Price: $ 2.25
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .025 SQ. TERMINAL STRIPS
More Detail: Connector Header Surface Mount 32 position 0.100" ...
DataSheet: TSM-116-03-L-DV-P-TR datasheetTSM-116-03-L-DV-P-TR Datasheet/PDF
Quantity: 1000
125 +: $ 2.02860
Stock 1000Can Ship Immediately
$ 2.25
Specifications
Operating Temperature: -55°C ~ 125°C
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Liquid Crystal Polymer (LCP)
Features: Pick and Place
Overall Contact Length: --
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Number of Positions Loaded: All
Packaging: Tape & Reel (TR) 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 32
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Series: TSM
Style: Board to Board or Cable
Shrouding: Unshrouded
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.420" (10.67mm)
Contact Length - Post: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

TSM-116-03-L-DV-P-TR is a type of Rectangular Connectors - Headers, Male Pins. The TSM-116-03-L-DV-P-TR offers reliable connections while offering a secure solution for signal transmission in a wide range of applications. The TSM-116-03-L-DV-P-TR was designed to interface with 0.100in pitch (2.54mm) terminals. It is specifically designed to connect to application-specific-requirements or designs.

Application Field

TSM-116-03-L-DV-P-TR is ideal for a wide variety of applications, ranging from computer peripherals and audio/video equipment to automotive and aerospace appliances. The TSM-116-03-L-DV-P-TR is highly compatible with many other types of connectors, affording users the flexibility to create entire assemblies with ease. It is also well-suited for applications where cost-efficiency is paramount, as it provides an economical solution while still providing excellent performance.

Working Principle

The main idea behind the TSM-116-03-L-DV-P-TR is a robust design which allows for excellent signal transmission. At the core of the design lies two separate signal paths – one for power and one for data. The power signal path is designed to ensure a low-loss and high-current transmission, while the data signal path is optimized to offer low-crosstalk and impeccable signal integrity.

To ensure that the signal paths remain reliable, the TSM-116-03-L-DV-P-TR uses a durable combination of two materials with different electronic characteristics. The data wires are made of a conductive material, while the ground wires are made of a low-conductance material that reliably transfers signals without electricity leakage. As a result, the TSM-116-03-L-DV-P-TR offers superior signal integrity and flexibility when interfacing with other connectors.

The TSM-116-03-L-DV-P-TR is equipped with strain relief that ensures a secure connection, while preventing any mechanical damage or inadvertent disconnections. The TSM-116-03-L-DV-P-TR also comes with a hermetic seal that protects both internal and external components from dust and water. Lastly, the TSM-116-03-L-DV-P-TR features clip-on retention, allowing for easy installation and safe operation.

Conclusion

Overall, the TSM-116-03-L-DV-P-TR is an excellent option for a variety of applications, whether it’s computer peripherals, audio/video equipment or automotive applications. Its combination of two signal paths, coupled with its strain relief and hermetic seal, make it an ideal solution for reliability and signal integrity. As such, it has quickly become a popular choice for many applications and continues to prove its worth.

The specific data is subject to PDF, and the above content is for reference

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