TSM-116-04-T-SH-A-P Allicdata Electronics
Allicdata Part #:

TSM-116-04-T-SH-A-P-ND

Manufacturer Part#:

TSM-116-04-T-SH-A-P

Price: $ 1.83
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .025 SQ. TERMINAL STRIPS
More Detail: Connector Header Surface Mount, Right Angle 16 pos...
DataSheet: TSM-116-04-T-SH-A-P datasheetTSM-116-04-T-SH-A-P Datasheet/PDF
Quantity: 1000
1 +: $ 1.64430
Stock 1000Can Ship Immediately
$ 1.83
Specifications
Operating Temperature: -55°C ~ 105°C
Insulation Height: 0.120" (3.05mm)
Contact Shape: Square
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: --
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Liquid Crystal Polymer (LCP)
Features: Board Guide, Pick and Place
Overall Contact Length: --
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Number of Positions Loaded: All
Packaging: Tube 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 16
Number of Rows: 1
Row Spacing - Mating: --
Series: TSM
Style: Board to Board or Cable
Shrouding: Unshrouded
Mounting Type: Surface Mount, Right Angle
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: --
Description

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Rectangular Connectors - Headers, Male Pins category has many applications, and an increasingly common model is TSM-116-04-T-SH-A-P connector. It is widely used in computers, automation and control systems, telecommunications, medical, audio-video, and other mechanical systems. The TSM-116-04-T-SH-A-P connector is a 16-pin 2.54mm pitch male header connector with insulation displacement contact. It has a strong mechanical structure, superior transmission speed, good electrical insulation properties, and reliable electrical connection.

The working principle of TSM-116-04-T-SH-A-P connector is fairly simple. When the connector is connected to the circuit board, the insulation displacement contact (IDC) will pierce through the insulation of the wire, and then the terminals will firmly grasp the wire. In addition, the similar wire connected to each IDC ensures that the contact is fully secure. The insulation displacement contact eliminates the need for manual wire stripping, thus reducing assembly time and cost.

The TSM-116-04-T-SH-A-P connector has many features that make it ideal for its various applications. It is very reliable and durable, with a life expectancy of up to 500 cycles. Furthermore, it has high temperature resistance and good electrical shock resistance. It also provides excellent signal integrity, with excellent crosstalk and reflection characteristics. Its strong mechanical structure ensures that connections stay tight and secure. Additionally, the TSM-116-04-T-SH-A-P connector is cost-effective compared to other types of connectors.

The TSM-116-04-T-SH-A-P connector is used in a variety of applications in the computing, automation, and telecommunication industries. It is used to connect circuit boards, to make pin-to-pin connections between different boards, and to provide power connections for various equipment. It is also used to provide power connections for networking applications, and in the medical industry to provide connections between medical equipment and laboratory systems. Its high performance and reliable connection make it the ideal choice for a wide variety of applications.

Overall, the TSM-116-04-T-SH-A-P connector is a reliable and cost-effective solution for connecting circuit boards, providing power, and making connections between different equipment and systems. Its insulation displacement contact feature improves efficiency and reduces assembly time, its mechanical strength ensures reliable connections, and its variety of features means it is suitable for a range of applications. The TSM-116-04-T-SH-A-P connector is an invaluable asset to the computing, automation, telecommunication, and medical industries.

The specific data is subject to PDF, and the above content is for reference

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