TSM-128-01-S-MT Allicdata Electronics
Allicdata Part #:

TSM-128-01-S-MT-ND

Manufacturer Part#:

TSM-128-01-S-MT

Price: $ 7.25
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .025 SQ. TERMINAL STRIPS
More Detail: Connector Header Surface Mount, Right Angle; Throu...
DataSheet: TSM-128-01-S-MT datasheetTSM-128-01-S-MT Datasheet/PDF
Quantity: 1000
1 +: $ 6.52050
Stock 1000Can Ship Immediately
$ 7.25
Specifications
Operating Temperature: -55°C ~ 125°C
Insulation Height: 0.240" (6.10mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Liquid Crystal Polymer (LCP)
Features: --
Overall Contact Length: --
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Number of Positions Loaded: All
Packaging: Tube 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 56
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Series: TSM
Style: Board to Board or Cable
Shrouding: Unshrouded
Mounting Type: Surface Mount, Right Angle; Through Hole
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.230" (5.84mm)
Contact Length - Post: 0.100" (2.54mm)
Description

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Rectangular Connectors, headers, male pins are used in a range of electronics applications. Among these is the TSM-128-01-S-MT, a male pin array designed to withstand high-speed performance. In this article, we discuss the application fields and working principles of this male pin array.

A typical application for the TSM-128-01-S-MT is in a telecommunications system for connecting phone service from a central exchange to a local area network of telephones. This system requires a standard, reliable connection over long distances. The TSM-128-01-S-MT male pin array is designed to provide a secure connection and prevent interference and crosstalk.

The TSM-128-01-S-MT male pin array has a metal body, which is gold plated for maximum conductivity. It is also designed to be extremely durable, with its pins constructed from solid metal, and its body constructed from high-strength alloys. In addition to its durability, the body is shaped in such a way that it is able to dissipate heat quickly and efficiently.

The TSM-128-01-S-MT male pin array also boasts a high-speed signal transmission rate. This is due to its metal body, which is designed to ensure a good signal transfer rate, preventing distortions and attenuation. Additionally, the array is designed to prevent unwanted noise and interference.

Moreover, a key feature of the TSM-128-01-S-MT male pin array is its interface, which is designed to provide a secure and reliable connection. The array has an undulating interface which allows for a stronger grip; this means that the connection is resistant to any twisting or movement and there is less chance for a disconnection.

The TSM-128-01-S-MT male pin array also features a dielectric layer which assists in preventing electrical shorts and protects against static build-up. The male pin array also provides a low capacitance, meaning that it can transfer high-frequency signals with minimal distortion.

In terms of working principles, the TSM-128-01-S-MT male pin array works by providing a strong, reliable connection between two or more components. In the telecommunications application mentioned earlier, the array would be used to connect the central exchange to the network of telephones. By providing a secure connection, the array allows for a reliable transfer of data and ensures that the connection is not lost.

In conclusion, the TSM-128-01-S-MT male pin array is ideal for use in a variety of electronics applications. Its metal body is designed to offer high levels of durability and also to dissipate heat, while its interface is designed to provide a secure and reliable connection. Furthermore, the array is designed with high-speed signal transmission in mind, and it also features a dielectric layer for prevention of electrical shorts and static build-up. The array provides a low capacitance for high-frequency signals, meaning that is able to transfer signals with minimal distortion.

The specific data is subject to PDF, and the above content is for reference

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