TSM-132-01-L-SH-P Allicdata Electronics
Allicdata Part #:

TSM-132-01-L-SH-P-ND

Manufacturer Part#:

TSM-132-01-L-SH-P

Price: $ 3.63
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .025 SQ. TERMINAL STRIPS
More Detail: Connector Header Surface Mount, Right Angle 32 pos...
DataSheet: TSM-132-01-L-SH-P datasheetTSM-132-01-L-SH-P Datasheet/PDF
Quantity: 1000
1 +: $ 3.26340
Stock 1000Can Ship Immediately
$ 3.63
Specifications
Operating Temperature: -55°C ~ 125°C
Insulation Height: 0.120" (3.05mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Liquid Crystal Polymer (LCP)
Features: Pick and Place
Overall Contact Length: --
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Number of Positions Loaded: All
Packaging: Tube 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 32
Number of Rows: 1
Row Spacing - Mating: --
Series: TSM
Style: Board to Board or Cable
Shrouding: Unshrouded
Mounting Type: Surface Mount, Right Angle
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.230" (5.84mm)
Contact Length - Post: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The TSM-132-01-L-SH-P rectangular connector is one of the most popular and widely used headers in the industry. It is designed for applications such as telecommunications, consumer electronics, robotic automation, medical equipment, and defense systems. It is characterized by good signal integrity and a reliable interconnectivity for low-power and high-speed applications. This header is one of the most cost-effective solutions for industrial and commercial applications.

The TSM-132-01-L-SH-P is a surface mount header that provides a quick, simple, and reliable means of connecting two devices. It comprises of two rows of four pins or sockets (typically with a gold or tin plating) and has two rows of contact pads on the top side that can be soldered. The header also provides a useful Locking System with a snap-in self-locking feature for increased temperature cycling performance.

The working principle of the TSM-132-01-L-SH-P is that it enables a convenient, high-speed connection between two systems. The contact pins are inserted into a mating socket, which securely locks the two pieces together to ensure good continuity. The current flow is transmitted along the four pins to provide a signal transmission, while the header also minimizes cross-talk and ensures a reliable connection. The locking mechanism ensures a sturdy fit between the two devices, making it ideal for use in high vibration environments.

The TSM-132-01-L-SH-P header has many applications, but it is mainly used in communication and other high speed data transfer applications. It is suitable for use in telecommunication networks, personal computers, consumer electronic devices, automated control systems, and medical equipment. It is designed for fast and reliable data transmission between devices, and its low profile design helps minimize its footprint on a circuit board. Its ability to handle high-speed signals and voltage fluctuations also makes it an ideal solution for applications that require robust data communication.

The TSM-132-01-L-SH-P header is an excellent option for connecting two devices quickly and reliably. It is one of the most popular headers on the market and can be found in a wide range of telecommunication, computer, robotic, and medical equipment applications. Its uses range from providing a quick and secure solution for high-speed data transfer between devices, to reliable signal transmission in harsh environmental conditions. Its quick insertion/removal makes it an ideal solution for any application that requires a stable, yet secure interconnect.

The specific data is subject to PDF, and the above content is for reference

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