
Allicdata Part #: | TSW-108-09-L-D-RA-ND |
Manufacturer Part#: |
TSW-108-09-L-D-RA |
Price: | $ 1.11 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Samtec Inc. |
Short Description: | .025'' SQ. TERMINAL STRIPS |
More Detail: | Connector Header Through Hole, Right Angle 16 posi... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 1.00170 |
Operating Temperature: | -55°C ~ 125°C |
Insulation Height: | 0.219" (5.56mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Finish - Post: | Tin |
Contact Material: | Phosphor Bronze |
Insulation Material: | Polybutylene Terephthalate (PBT) |
Features: | -- |
Overall Contact Length: | -- |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Black |
Current Rating: | -- |
Voltage Rating: | -- |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | -- |
Applications: | -- |
Number of Positions Loaded: | All |
Packaging: | Bulk |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 16 |
Number of Rows: | 2 |
Row Spacing - Mating: | 0.100" (2.54mm) |
Series: | TSW |
Style: | Board to Board or Cable |
Shrouding: | Unshrouded |
Mounting Type: | Through Hole, Right Angle |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.230" (5.84mm) |
Contact Length - Post: | 0.290" (7.37mm) |
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Rectangular connectors provide mechanical support for electronic components while also providing electrical connections between circuits. These can be configured in many formats and a variety of contact arrangements, allowing for flexibility in meeting the needs of different applications. Headers, male pins and receptacles are all popular and versatile components of rectangular interconnects.
The TSW-108-09-L-D-RA is a header from TE Connectivity that offers header technology in a compact package, making it suitable for applications requiring space-saving electrical connections in today’s increasingly miniaturized electronics. It features a low profile design and has a contact pitch of 0.8mm, allowing it to provide secure electrical connections in a small form factor.
Having established its connection format, let’s take a look at the applications and principles of the TSW-108-09-L-D-RA. The header is used in a variety of industrial, medical and automotive applications and is ideal for applications where a high number of connections need to be made within a limited amount of space. Typical applications include power supplies, PCBs, consumer electronics, healthcare and automotive.
The TSW-108-09-L-D-RA is designed to provide a reliable electrical connection between electronic components. It operates on the principle of providing mechanical support to electronic components while also providing electrical connections between circuits. The header is also designed to meet stringent requirements such as robustness, durability, high cycle life, and reliability.
TE Connectivity’s TSW-108-09-L-D-RA is a popular choice for anyone looking for a reliable and durable header with minimal signal and power loss. It features a tin-plated steel shell which provides superior shielding and EMI/RFI interference protection as well as a gold plated phosphor bronze contacts for superior electrical performance. The header has a double beam contact system to ensure a secure contact between the pins and the mating components.
The TSW-108-09-L-D-RA also employs a blind mating design which makes it suitable for use in applications where the components may not be readily visible or accessible. This is combined with a wide range of plating options including Tin and Gold on its contacts. This allows for increased flexibility and helps to meet the needs of different applications.
Overall, the TSW-108-09-L-D-RA is an ideal solution for anyone looking for a reliable and durable header with minimal signal and power loss. Its small form factor, combined with its blind mating design, make it ideal for applications where a high number of connections need to be made within a limited amount of space. It is also highly customisable, allowing for increased flexibility and enabling engineers to create bespoke solutions and meet the needs of different applications.
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