TSW-110-19-H-D Allicdata Electronics
Allicdata Part #:

TSW-110-19-H-D-ND

Manufacturer Part#:

TSW-110-19-H-D

Price: $ 2.79
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .025'' SQ. TERMINAL STRIPS
More Detail: Connector Header Through Hole 20 position 0.100" (...
DataSheet: TSW-110-19-H-D datasheetTSW-110-19-H-D Datasheet/PDF
Quantity: 1000
1 +: $ 2.50740
Stock 1000Can Ship Immediately
$ 2.79
Specifications
Operating Temperature: -55°C ~ 125°C
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Material: Phosphor Bronze
Insulation Material: Polybutylene Terephthalate (PBT)
Features: --
Overall Contact Length: 1.030" (26.16mm)
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: 3.00µin (0.076µm)
Applications: --
Number of Positions Loaded: All
Packaging: Bulk 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 20
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Series: TSW
Style: Board to Board or Cable
Shrouding: Unshrouded
Mounting Type: Through Hole
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.820" (20.83mm)
Contact Length - Post: 0.110" (2.79mm)
Description

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The TSW-110-19-H-D is an ideal rectangular connector header designed for use in a number of different applications. It is a male-to-male interconnect header with a low profile design that makes it suitable for space-constrained environments. It is well-suited for use with both PCB and non-PCB headers and applications. The device provides reliable and secure connections and is compatible with a wide variety of mating connectors.

The TSW-110-19-H-D rectangular connector header has a 19-way mating configuration with 0.100 inch single row pins. The header is available in two different pin orientations, making it suitable for connecting to a variety of systems. The pins are straight and non-locking in design, providing maximum mechanical robustness in applications where the pins may be exposed to frequent connections and disconnections. The body of the connector also features a raised, reinforced plastic collar that provides extra protection against shock and vibration.

The TSW-110-19-H-D rectangular connector header is a popular choice for use in industrial automation and control, robotics, medical equipment, and other high-density wiring applications. It is also commonly used for data and power connections in consumer and commercial electronics. The header is ideal for use in applications requiring high-speed data transfer, as well as those requiring connections with electrical and thermal stability. The connector’s low profile design makes it suitable for space-restricted applications as well.

The TSW-110-19-H-D rectangular connector header is a versatile device that can be used in a number of different applications. It is designed for use in a variety of high-speed, high-density, and low-profile applications, and is suitable for use in both PCB and non-PCB headers. The device provides a reliable connection with both electrical and mechanical stability, and is compatible with a variety of different mating connectors.

The working principle of the TSW-110-19-H-D rectangular connector header is fairly straightforward. The device is designed with two sets of pins, one set being straight while the other being offset. The pins from the opposing set are then overlapped and inserted into the connector. This creates a secure connection that is protected from outside elements as well as providing a secure, electrically stable interface.

In conclusion, the TSW-110-19-H-D rectangular connector header is a versatile device designed for a wide range of applications. It is suitable for use in high-speed, high-density, and low-profile applications, and provides a reliable connection that is both mechanically and electrically stable. The device’s low profile makes it suitable for space-constrained environments, while its straightforward working principle ensures that connecting to and disconnecting from the device will be a simple and hassle-free process.

The specific data is subject to PDF, and the above content is for reference

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