Allicdata Part #: | TSW-110-20-G-D-ND |
Manufacturer Part#: |
TSW-110-20-G-D |
Price: | $ 1.84 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Samtec Inc. |
Short Description: | .025'' SQ. TERMINAL STRIPS |
More Detail: | Connector Header Through Hole 20 position 0.100" (... |
DataSheet: | TSW-110-20-G-D Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 1.65690 |
Operating Temperature: | -55°C ~ 125°C |
Insulation Height: | 0.100" (2.54mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Finish - Post: | Gold |
Contact Material: | Phosphor Bronze |
Insulation Material: | Polybutylene Terephthalate (PBT) |
Features: | -- |
Overall Contact Length: | 1.230" (31.24mm) |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Black |
Current Rating: | -- |
Voltage Rating: | -- |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | 3.00µin (0.076µm) |
Applications: | -- |
Number of Positions Loaded: | All |
Packaging: | Bulk |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 20 |
Number of Rows: | 2 |
Row Spacing - Mating: | 0.100" (2.54mm) |
Series: | TSW |
Style: | Board to Board or Cable |
Shrouding: | Unshrouded |
Mounting Type: | Through Hole |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 1.020" (25.91mm) |
Contact Length - Post: | 0.110" (2.79mm) |
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TSW-110-20-G-D is a type of rectangular connector-headers, male pins that have extensive usage in a great number of applications. The connectors provide a high-quality interconnect system that offers reliable contact retention and ensures electrical continuity.
The TSW - 110 - 20 - G - D connectors are typically used for applications such as consumer electronics, communication systems, medical equipment, semiconductor test/packaging, off-board circuitry and automotive electronic circuitry.
The TSW connector is designed with an ultra-low profile that fits into tight spaces while also providing reliable vibration resistance and reliable electrical continuity. It is also designed to be robust enough to withstand the rigors of intense shock and vibration that occurs in many industrial and consumer electronic applications.
The connectors are also designed to offer maximum signal integrity with low insertions loss to ensure the reliable transmission of data in electronic systems. The slim design and low profile make the TSW connectors suitable for a wide range of application requiring intricate on-board components.
The TSW connector can provide electrical continuity between circuit boards or modules even with significant vibration and shock. The high temperature thermoplastic housing is designed to protect the pins from the environment while providing maximum insulation against noise. Additionally, its low profile design minimizes the connector’s profile while providing maximum contact points.
The working principle of the TSW - 110 - 20 - G - D connector is simple and easy to understand. The connectors consist of two parts; one part is the housing and the other is the contact pins. The housing comprises of thermoplastic material that is designed to provide maximum protection from environmental elements such as moisture and dust. The contact pins are usually made of brass and are designed to provide reliable electrical continuity between circuits or components.
The housing and contact pins are designed with metal-on-metal backstop tabs that prevent unwanted withdrawal of the contact pins from the connector. This ensures reliable mating and electrical continuity even when exposed to severe vibration and shock. The housing also provides a locking mechanism to ensure that the pins remain securely in place even during heavy vibrations.
The TSW - 110 - 20 - G - D connector offers a simple and reliable interconnect system for a variety of electronic systems. The metal-on-metal backstop tabs help prevent disconnection of the contacts due to harsh environments, while the high-temperature thermoplastic housing provides maximum insulation and signal integrity. The low-profile design is perfect for tight spaces while providing reliable vibration and shock resistance for robust applications.
The specific data is subject to PDF, and the above content is for reference
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