Allicdata Part #: | TSW-110-22-H-D-ND |
Manufacturer Part#: |
TSW-110-22-H-D |
Price: | $ 2.26 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Samtec Inc. |
Short Description: | .025'' SQ. TERMINAL STRIPS |
More Detail: | Connector Header Through Hole 20 position 0.100" (... |
DataSheet: | TSW-110-22-H-D Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 2.03490 |
Operating Temperature: | -55°C ~ 125°C |
Insulation Height: | 0.100" (2.54mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Post: | Gold |
Contact Material: | Phosphor Bronze |
Insulation Material: | Polybutylene Terephthalate (PBT) |
Features: | -- |
Overall Contact Length: | 0.630" (16.00mm) |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Black |
Current Rating: | -- |
Voltage Rating: | -- |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | 3.00µin (0.076µm) |
Applications: | -- |
Number of Positions Loaded: | All |
Packaging: | Bulk |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 20 |
Number of Rows: | 2 |
Row Spacing - Mating: | 0.100" (2.54mm) |
Series: | TSW |
Style: | Board to Board or Cable |
Shrouding: | Unshrouded |
Mounting Type: | Through Hole |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.230" (5.84mm) |
Contact Length - Post: | 0.300" (7.62mm) |
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Rectangular connectors are frequently used in modern electronic circuit boards and are an essential part of many industrial applications. In this article, we will focus on TSW-110-22-H-D headers, which are mainly used in computer and telecommunications equipment. We will examine their application field, working principle, and advantages.
Application Field
TSW-110-22-H-D headers are medium-sized headers designed for high-density and low-profile applications. They have low insertion force and high contact reliability which makes them ideal for use in computer and telecommunications equipment. The headers are commonly found in computer motherboards, network routers, modems, and other electronic devices. Other applications include audio-visual equipment, medical equipment, and industrial equipment such as automatic test equipment and electrical components.
Working Principle
TSW-110-22-H-D headers are designed with an insulator body and several spring-loaded contacts. The contacts are inserted into the insulator body and are soldered to a printed circuit board (PCB). The contacts provide a highly reliable electrical connection between the PCB and the device it is connected to. The spring-loaded contacts ensure maximum contact force, which is especially important in applications where vibration and shock can cause intermittent contact failures. The contacts are also resistant to corrosion and can withstand high temperatures.
Advantages
TSW-110-22-H-D headers offer many advantages over traditional connectors. First, they are designed for high-density and low-profile applications, which saves space on the PCB. Second, the spring-loaded contacts provide an improved contact force and stability compared to other types of rectangulare connectors. The contacts are also corrosion-resistant and have a high temperature rating. Finally, the headers are designed with an easy-to-use push-in installation method, making assembly quick and easy. This is especially important in high-volume production runs.
Conclusion
TSW-110-22-H-D headers are ideal for high-density and low-profile applications in computer and telecommunications equipment. They are designed with an insulator body, spring-loaded contacts, and an easy-to-use push-in installation method. This provides maximum contact force and reliability in applications where vibration and shock can cause intermittent contact failures. Additionally, the connectors offer corrosion resistance and a high temperature rating. Taken together, these features make TSW-110-22-H-D connectors a great choice for high-density and low-profile applications in the telecommunications and computer industries.
The specific data is subject to PDF, and the above content is for reference
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