TSW-110-22-H-D Allicdata Electronics
Allicdata Part #:

TSW-110-22-H-D-ND

Manufacturer Part#:

TSW-110-22-H-D

Price: $ 2.26
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .025'' SQ. TERMINAL STRIPS
More Detail: Connector Header Through Hole 20 position 0.100" (...
DataSheet: TSW-110-22-H-D datasheetTSW-110-22-H-D Datasheet/PDF
Quantity: 1000
1 +: $ 2.03490
Stock 1000Can Ship Immediately
$ 2.26
Specifications
Operating Temperature: -55°C ~ 125°C
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Material: Phosphor Bronze
Insulation Material: Polybutylene Terephthalate (PBT)
Features: --
Overall Contact Length: 0.630" (16.00mm)
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: 3.00µin (0.076µm)
Applications: --
Number of Positions Loaded: All
Packaging: Bulk 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 20
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Series: TSW
Style: Board to Board or Cable
Shrouding: Unshrouded
Mounting Type: Through Hole
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.230" (5.84mm)
Contact Length - Post: 0.300" (7.62mm)
Description

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Rectangular connectors are frequently used in modern electronic circuit boards and are an essential part of many industrial applications. In this article, we will focus on TSW-110-22-H-D headers, which are mainly used in computer and telecommunications equipment. We will examine their application field, working principle, and advantages.

Application Field

TSW-110-22-H-D headers are medium-sized headers designed for high-density and low-profile applications. They have low insertion force and high contact reliability which makes them ideal for use in computer and telecommunications equipment. The headers are commonly found in computer motherboards, network routers, modems, and other electronic devices. Other applications include audio-visual equipment, medical equipment, and industrial equipment such as automatic test equipment and electrical components.

Working Principle

TSW-110-22-H-D headers are designed with an insulator body and several spring-loaded contacts. The contacts are inserted into the insulator body and are soldered to a printed circuit board (PCB). The contacts provide a highly reliable electrical connection between the PCB and the device it is connected to. The spring-loaded contacts ensure maximum contact force, which is especially important in applications where vibration and shock can cause intermittent contact failures. The contacts are also resistant to corrosion and can withstand high temperatures.

Advantages

TSW-110-22-H-D headers offer many advantages over traditional connectors. First, they are designed for high-density and low-profile applications, which saves space on the PCB. Second, the spring-loaded contacts provide an improved contact force and stability compared to other types of rectangulare connectors. The contacts are also corrosion-resistant and have a high temperature rating. Finally, the headers are designed with an easy-to-use push-in installation method, making assembly quick and easy. This is especially important in high-volume production runs.

Conclusion

TSW-110-22-H-D headers are ideal for high-density and low-profile applications in computer and telecommunications equipment. They are designed with an insulator body, spring-loaded contacts, and an easy-to-use push-in installation method. This provides maximum contact force and reliability in applications where vibration and shock can cause intermittent contact failures. Additionally, the connectors offer corrosion resistance and a high temperature rating. Taken together, these features make TSW-110-22-H-D connectors a great choice for high-density and low-profile applications in the telecommunications and computer industries.

The specific data is subject to PDF, and the above content is for reference

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