Allicdata Part #: | TSW-110-26-F-Q-ND |
Manufacturer Part#: |
TSW-110-26-F-Q |
Price: | $ 1.62 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Samtec Inc. |
Short Description: | .025'' SQ. TERMINAL STRIPS |
More Detail: | Connector Header Through Hole 20 position 0.100" (... |
DataSheet: | TSW-110-26-F-Q Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 1.46160 |
Operating Temperature: | -55°C ~ 125°C |
Insulation Height: | 0.100" (2.54mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 3.00µin (0.076µm) |
Contact Finish - Post: | Tin |
Contact Material: | Phosphor Bronze |
Insulation Material: | Polybutylene Terephthalate (PBT) |
Features: | -- |
Overall Contact Length: | 0.456" (11.58mm) |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Black |
Current Rating: | -- |
Voltage Rating: | -- |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | -- |
Applications: | -- |
Number of Positions Loaded: | All |
Packaging: | Bulk |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 20 |
Number of Rows: | 2 |
Row Spacing - Mating: | 0.200" (5.08mm) |
Series: | TSW |
Style: | Board to Board or Cable |
Shrouding: | Unshrouded |
Mounting Type: | Through Hole |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.230" (5.84mm) |
Contact Length - Post: | 0.126" (3.20mm) |
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Rectangular Connectors -Headers, Male Pins are electrical connectors made of plastic and metal, used primarily in industrial applications.
TSW-110-26-F-Q connectors are most commonly used in electronic and electrical applications where the field requires the simple connection of electrical components. This type of connector is a low Profile IDC header with a standard 2.54mm spacing and 0.45mm pitch, making it suitable for a wide range of applications.
Application Field
TSW-110-26-F-Q connectors are typically used in environments where small form factor connectors are needed and space is limited, such as computer motherboards, laptops, and embedded control systems. These connectors are also widely used in automotive, telecommunications, medical, and industrial applications.
The small form factor of the TSW-110-26-F-Q connectors makes them suitable for applications in limited space such as on motherboards or for wireless and internet of things (IoT) applications. These connectors are ideal for applications that require high-speed communication, signal, and power transfer. TSW-110-26-F-Q connectors are typically used in a variety of applications including: PCBA Assemblies, Communication Devices, Automation Equipment and Network Equipment.
Working Principle
The working principle of a TSW-110-26-F-Q is the same as that of any other electrical connector. Electrical signals must pass through the pins in order for the electronic components connected to them to perform their intended functions. The pins are typically a metal, though they can also be plastic, with contact points at each end so that the device can be connected to an external circuit.
The pins are connected to the housing of the connector, which is usually made of plastic or metal. The housing is designed to allow the pins to be inserted and securely held in place. It is also designed to prevent corrosion and provide enough shielding so that external electromagnetic interference does not affect the performance of the device.
The TSW-110-26-F-Q connector also includes a strain relief clip, which ensures that the connector is securely fastened to the housing and prevents the pins from being pulled out accidentally.
The TSW-110-26-F-Q also includes gold plated contacts which improve signal integrity and reduce contact resistance. This is important when transferring high frequency electrical signals in order to avoid data loss or corruption. Gold plated contacts also offer superior corrosion resistance, increasing the lifespan of the connector.
The TSW-110-26-F-Q connectors offer superior performance in a variety of applications, making them the ideal choice for any application where space is limited and high quality signal transfer is a priority.
The specific data is subject to PDF, and the above content is for reference
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