Allicdata Part #: | SAM1081-14-ND |
Manufacturer Part#: |
TSW-114-26-S-S |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Samtec Inc. |
Short Description: | CONN HEADER 14POS .100" SGL GOLD |
More Detail: | Connector Header Through Hole 14 position 0.100" (... |
DataSheet: | TSW-114-26-S-S Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | TSW |
Packaging: | Bulk |
Part Status: | Discontinued at Digi-Key |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 14 |
Number of Rows: | 1 |
Row Spacing - Mating: | -- |
Number of Positions Loaded: | All |
Style: | Board to Board or Cable |
Shrouding: | Unshrouded |
Mounting Type: | Through Hole |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.230" (5.84mm) |
Contact Length - Post: | 0.126" (3.20mm) |
Overall Contact Length: | 0.456" (11.58mm) |
Insulation Height: | 0.100" (2.54mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Post: | Tin |
Contact Material: | Phosphor Bronze |
Insulation Material: | Polybutylene Terephthalate (PBT) |
Features: | -- |
Operating Temperature: | -55°C ~ 125°C |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Black |
Current Rating: | -- |
Voltage Rating: | -- |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | -- |
Applications: | -- |
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Rectangular Connectors - Headers, Male Pins, encompasses an extensive range of devices designed to connect two circuits in a permanent or semi-permanent fashion. They are available in various sizes and configurations, and for a variety of applications. One of the most popular of these connectors is the TSW-114-26-S-S.
The TSW-114-26-S-S is a male pin header developed for low-power and low-voltage applications. It is designed to connect two sub-circuits together, and has a height of 22.5 mm and a width of 5.08 mm. It is made of a single-piece of stamped and formed steel, and is available with 25, 19, or 15 pins in an L-shaped configuration. The TSW-114-26-S-S is suitable for both through-hole and surface-mount mounting.
The TSW-114-26-S-S features a top-hat design which allows it to be used with a wide range of circuit board materials, making it a versatile and cost-effective solution. Its nickel-plating provides corrosion resistance and extends the service life of the connector. It also has an insulation displacement feature which eliminates the need for manual wire-stripping and soldering. This ensures secure and reliable inter-circuit connections.
The TSW-114-26-S-S is ideally suited for applications where low-level signals are exchanged. It can be used in the communications industry, for connecting wireless modems and base-stations, 2G/3G/4G routers, antennas and antennas systems. It is also commonly used in industrial automation and process control systems, electrical and electronics engineering, medical and safety equipment, instrumentation, consumer electronics, radio and television broadcast equipment, and automotive electronics.
The TSW-114-26-S-S benefits from a unique working principle. The top-hat design enables the connector to be mounted very easily and quickly, making it suitable for high-production applications. The insulation displacement feature ensures a secure and reliable inter-circuit connection by eliminating the need for manual wire-stripping and soldering. This makes the TSW-114-26-S-S suitable for a wide range of applications requiring minimal assembly time and maximum reliability.
In conclusion, the TSW-114-26-S-S provides a reliable, cost-effective way of connecting two sub-circuits. It is suitable for both through-hole and surface-mount applications, and features a unique top-hat design as well as an insulation displacement feature which ensures a secure inter-circuit connection. The TSW-114-26-S-S is ideally suited for applications requiring the transmission of low-level signals, and is frequently used in the communications industry, for connecting wireless modems and base-stations, as well as in industrial automation and process control systems, electrical and electronics engineering, and other fields.
The specific data is subject to PDF, and the above content is for reference
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