TSW-117-26-S-D Allicdata Electronics
Allicdata Part #:

SAM1080-17-ND

Manufacturer Part#:

TSW-117-26-S-D

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: CONN HEADER 34POS .100" DL GOLD
More Detail: Connector Header Through Hole 34 position 0.100" (...
DataSheet: TSW-117-26-S-D datasheetTSW-117-26-S-D Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Operating Temperature: -55°C ~ 125°C
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Polybutylene Terephthalate (PBT)
Features: --
Overall Contact Length: 0.456" (11.58mm)
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Number of Positions Loaded: All
Packaging: Bulk 
Part Status: Discontinued at Digi-Key
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 34
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Series: TSW
Style: Board to Board or Cable
Shrouding: Unshrouded
Mounting Type: Through Hole
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.230" (5.84mm)
Contact Length - Post: 0.126" (3.20mm)
Description

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Rectangular Connectors - Headers, Male Pins provide a secure and reliable connection for various electronic components. One of the most notable among them is the TSW-117-26-S-D. This component is designed to provide an efficient signal transfer and a durable electrical connection in a variety of applications. In order to better understand the usability of this component, this article will explore the [TSW-117-26-S-D application field and working principle.]

The TSW-117-26-S-D is a low profile male pin connector, with an overall length of just 117.7mm, and a width of just 26.3mm. This makes it ideal for application in confined or restricted environments. It has a standard pitch of 2.54 mm, with an 8-pin configuration, allowing for reliable signal transfer. The component is designed with a tin-plated copper alloy contact, integrated into its sturdy plastic housing, and able to withstand temperature ranges of -20°C- +85°C. The insulation resistance of this component is rated at 1000 MΩ and above, ensuring a reliable and secure electrical connection.

Looking at the applications, the TSW-117-26-S-D is commonly used in mobile devices, personal computers, network equipment, and many other applications which require a low profile cable assembly. This includes applications such as motherboards, GPS modules, memory cards, surveillance cameras, and a wide range of other consumer electronics. With its durable and reliable electrical connection, it is ideal for any application requiring reliable performances and signal-transfer.

In terms of working principle, the TSW-117-26-S-D is designed for quick and easy assembly. It consists of two flexible mating sections, with a secure solderless connect for a reliable electrical connection. The assembly process is relatively simple and requires minimal tools. The first step is to cut the required length of the cable and then the two sections are installed into either end. Next, the two sections are pushed together, so that the pins of both sections are securely pressed and locked together. Finally, the pins are soldered to ensure the reliable connection.

In conclusion, the TSW-117-26-S-D is a low-profile rectangular connector, designed for reliable signal-transfer and a secure electrical connection. It is often used in mobile devices, personal computers, and a variety of other applications. The installation process for the component is relatively simple to carry out, requiring only minimal tools and providing a reliable electrical connection. Therefore, the TSW-117-26-S-D is an invaluable component for those looking to make reliable connections in confined or restricted environments.

The specific data is subject to PDF, and the above content is for reference

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