TSW-127-08-S-S Allicdata Electronics
Allicdata Part #:

SAM1046-27-ND

Manufacturer Part#:

TSW-127-08-S-S

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: CONN HEADER 27POS .100" SGL GOLD
More Detail: Connector Header Through Hole 27 position 0.100" (...
DataSheet: TSW-127-08-S-S datasheetTSW-127-08-S-S Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Operating Temperature: -55°C ~ 125°C
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Polybutylene Terephthalate (PBT)
Features: --
Overall Contact Length: 0.530" (13.46mm)
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Number of Positions Loaded: All
Packaging: Bulk 
Part Status: Discontinued at Digi-Key
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 27
Number of Rows: 1
Row Spacing - Mating: --
Series: TSW
Style: Board to Board or Cable
Shrouding: Unshrouded
Mounting Type: Through Hole
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.230" (5.84mm)
Contact Length - Post: 0.200" (5.08mm)
Description

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The TSW-127-08-S-S Rectangular Connector – Header, Male Pin is a compact, versatile electrical connector designed for applications that need a reliable connection with a minimum of wiring. The TSW-127-08-S-S features a three-terminal pin style design, allowing for high-density connections with a maximum current rating of 3 Amps.

The TSW-127-08-S-S is ideally suited for the interconnection of high-density devices, providing reliable contact over long periods of use. It is well suited for a variety of applications, including instrumentation, medical equipment, industrial automation, telecommunications, and automotive electronics. With its low profile design, it is particularly suitable for board-to-board connections in tight spaces.

The TSW-127-08-S-S header is constructed from a combination of insulating plastic body and metal alloy contacts, which are resiliently biased to the board. This combination of materials provides superior seating force of the contacts and ensures high reliability even in harsh operating environments.

The header consists of three parts – an insulating body, a set of metal alloy male contacts, and retention/release slots that hold the contacts in place. The contacts are pre-formed to reduce installation time and ensure a secure connection. The male contacts are designed to penetrate the mating pad on the board and contact the ground plane on the other side of the board.

Once the contacts are inserted, they are retained in the board through their retention/release slots. This connection method ensures that the connection is strong and reliable, and that the contacts won\'t come out of the board. Furthermore, the TSW-127-08-S-S header features a design that prevents the ingress of dust and moisture, providing a reliable connection that is resistant to temperature variations and dirt.

In addition, the TSW-127-08-S-S offers a wide range of plating materials and contact configurations, allowing for customized solutions. The available plating options include Electroless Nickel Plating (ENP), Electroless Nickel Plating over Gold (ENPG), Gold Plating, Tin Plating and more. The contact configurations range from single row to triple row, with varying pin numbers from 4 to 16.

The TSW-127-08-S-S is designed to provide a secure and reliable connection in harsh environment applications, making it the ideal choice for a variety of applications. It is a compact, reliable solution that is designed to provide outstanding performance, even in the toughest environments.

The specific data is subject to PDF, and the above content is for reference

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