TSW-133-23-G-S

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Rectangular Connectors - Headers, Male Pins, encompass a variety of professional grade interconnect solutions including the TSW-133-23-G-S. Providing a reliable and secure transmission of both power and signal within circuits, the TSW-133-23-G-S is widely used across a range of industries including aerospace, medical, industrial automation and military/government.

The TSW-133-23-G-S is a professional grade dual row pin header that provides robust interconnect solutions for today\'s stringent requirements. It is engineered to meet tight dimensional tolerances and is Robust to withstand the harsh environmental conditions found in military and aerospace applications. Featuring a solid beam box design, the TSW-133-23-G-S offers maximum solder retention, high temperature performance, and improved for better sealing properties. This header type also utilizes a scoop-proof design to prevent unintentional mating.

The TSW-133-23-G-S is suitable for multiple applications and can provide reliable connections for a variety of industries that require robust and reliable solutions. Aerospace applications can utilize the high temperature performance and robustness of this header while the scoop-proof design and enhanced solder retention can be essential for military and government programs. Additionally, in the medical industry, the TSW-133-23-G-S provides a dependable and secure interconnect solution for electrical stimulation and other biological measurement systems.

In terms of design and construction, the TSW-133-23-G-S consists of a plated brass body, 22 machined pins, and a high temperature epoxy compliant with MIL-PRF-55536, MIL-STD- 1904 and UL 94V-0. It also features a reliable Long Plug Mating Force with a current rating of 5.0A. The dimensions of the header are 12.5mm x 5.55mm, with the contact pitch being 0.1mm which provides a reliable interconnection between circuits. Furthermore, it is rated for temperatures up to 250°C, making it ideal for harsh environment applications.

The TSW-133-23-G-S features a working principle that enables reliable and secure connections with circuits, hence allowing an efficient transmission of signals and power. It is designed with compliant beam box technology that increases the solder retention and provides additional electrical shielding, which helps to reduce crosstalk and EMI. Additionally, the unique scoop-proof design reduces unintentional mating, providing a secured solution for applications that require reliable connectors.

This header is also engineered to meet tight dimensional tolerances and withstand harsh environmental conditions. It utilizes MIL-PRF-55536, MIL-STD-1904, and UL 94V-0 compliant high temperature epoxy to increase robustness while its Long Plug Mating Force provides a secure connection with minimal force.

The TSW-133-23-G-S is a professional grade dual row pin header that provides a reliable and secure interconnection solution for any application. It has a wide array of applications including aerospace, medical, industrial automation and military/governmental applications due to its durable construction and reliable connections. It features MIL-PRF-55536, MIL-STD-1904 and UL 94V-0 compliant high temperature epoxy that increases its robustness and allows it to work in harsh environment applications. Additionally, its scoop-proof design assists in preventing unintentional mating and its Long Plug Mating Force ensures a secure connection with minimal force. Overall, the TSW-133-23-G-S is the ideal choice for any application needing reliable and secure connections.

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