WP3-S012VA1-EVT

The WP3-S012VA1-EVT is a type of rectangular connector which falls into the board-to-board mezzanine category. This device has a number of features and capabilities which gives it Application Field and Working Principles. The following paragraphs will discuss the specifics of this device.This connector has a pitch of 1.00mm, with an overall size of 12mm x 8mm. It incorporates contactless technology, allowing for faster connection speeds and higher reliability during data transmission. This type of connector is mainly used for applications like board-to-board mezzanine, internal USB 3.0, USB 2.0, IDE, COM, SATA, audio/video, daughter boards, and FPC interconnection. It is a highly efficient connector for high density, electromagnetic interference (EMI) containment applications.This device has a total of 12 contacts arranged in an array, with a 0.50mm staggered square pitch. This design provides it with excellent electrical and mechanical reliability, and its high priced terminal contacts make it highly resistant to shock and vibration. Furthermore, its gold-plated contact surfaces give it excellent electrical contact performance.On the working principles side of the connector, it is a 10-part crimp contact connection system that employs a compression force to ensure secure contact mating. It has a very low contact resistance and excellent insulation characteristics, as well as a higher vibration resistance compared to similar connectors.As far as the contact structure is concerned, the WP3-S012VA1-EVT is a single-piece, unslotted design. This allows it to greatly reduce the installation cost, and its low profile design is only 1.15mm in height. Additionally, it uses a stainless steel shell for superior protection against corrosion and abrasion, ensuring long-term reliable use.Overall, the WP3-S012VA1-EVT is a very reliable connector which offers a great combination of features and capabilities. It is highly efficient and reliable, and its versatility makes it suitable for a variety of applications. The design and construction of the device also make it ideal for board-to-board mezzanine and other high density, EMI containment applications.