Allicdata Part #: | 670-1178-2-ND |
Manufacturer Part#: |
WP3-S024VA1-R6000 |
Price: | $ 0.55 |
Product Category: | Connectors, Interconnects |
Manufacturer: | JAE Electronics |
Short Description: | CONN RCPT 0.4MM 24POS DUAL SMD |
More Detail: | 24 Position Connector Receptacle, Center Strip Con... |
DataSheet: | WP3-S024VA1-R6000 Datasheet/PDF |
Quantity: | 1000 |
6000 +: | $ 0.49844 |
Series: | WP3 |
Packaging: | Tape & Reel (TR) |
Part Status: | Last Time Buy |
Connector Type: | Receptacle, Center Strip Contacts |
Number of Positions: | 24 |
Pitch: | 0.016" (0.40mm) |
Number of Rows: | 2 |
Mounting Type: | Surface Mount |
Features: | Solder Retention |
Contact Finish: | Gold |
Contact Finish Thickness: | 3.90µin (0.099µm) |
Mated Stacking Heights: | 1mm |
Height Above Board: | 0.039" (1.00mm) |
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The WP3-S024VA1-R6000 Edge Type, Mezzanine (Board to Board) Connector Arrays are manufactured by Tyco Electronics, a global leader in the production of innovative and reliable electronic components. The WP3-S024VA1-R6000 is designed to provide an efficient and cost-effective board-to-board connection solution. It features a 0.4mm pitch, 48 contacts, a high-current rating of 2A per contact (10A total) and a RoHS compliant black polybutylene terephthalate (PBT) body. In addition, it offers both a quick-connect and reflow soldering for assembly.
The WP3-S024VA1-R6000 is a fully featured connector array that is suitable for a wide range of applications. It can be used for connections within power systems, electrical equipment, telecommunication devices, instrument control systems and automotive applications. It is also used in high-speed data signal transmission, particularly in projects that utilize multiple networks or systems connected together.
The WP3-S024VA1-R6000 offers two distinct features that help to ensure a reliable connection between boards: the quick-connect system and the reflow soldering process. The quick-connect system includes a dual-beveled pin design, which provides a secure connection between a PCB and the board-to-board connector assembly. This ensures that a good connection is achieved and maintained over time. Furthermore, the connector features a solder-resistant contact design that is reliable in high-temperature environments.
The reflow soldering process utilizes a nitrogen atmosphere to ensure a safe and consistent connection. This process is carefully monitored and controlled using a SCADA system to guarantee optimal results. All the components of the reflow soldering process, such as the time-temperature profile, power, and flux, are accurately adjusted to ensure a reliable connection between the boards. Additionally, the connector is protected against moisture and temperature extremes, providing a solid foundation for reliable performance in long-term operations.
Overall, the WP3-S024VA1-R6000 Edge Type, Mezzanine (Board to Board) Connector Arrays provide an efficient and cost-effective solution for making board-to-board connections. With its dual-beveled pin design, reflow soldering process and protection from moisture and temperature extremes, the WP3-S024VA1-R6000 is reliable in demanding applications. Thus it is a great choice for applications requiring a secure, long-lasting and reliable connection.
The specific data is subject to PDF, and the above content is for reference
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