WP9-S024VA1-R6000

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The WP9-S024VA1-R6000 series is a family of edge array mezzanine connectors used in board-to-board applications. This series features a sandwiched construction for interconnecting two printed circuit boards (PCBs) on opposite sides of an assembly, and they are typically used in applications where a connector needs to be mounted on both PCB sides. This connector also has a rectangular footprint, which makes it suitable for applications where space is at a premium. Furthermore, the high reliability of the connector ensures that it is well-suited for demanding environments.

The WP9-S024VA1-R6000 is a two-dimensional board-to-board mezzanine connector system, which is terminated directly to the board using soldering or press fit technology. It offers increased flexibility and scalability compared to standard board-to-board connectors, as the arrayed connectors can be used for a variety of custom applications. This connector also allows for up to 6 rows and 44 columns of contact positions, with a contact spacing of 0.5mm and a contact height of 1.5mm. This provides high density, which is beneficial in applications where space is at a premium.

The WP9-S024VA1-R6000 connectors feature a vertical mating interface, a double row mating socket, and an automatic polarization design to ensure proper mating. The combination of these features also allows for blind mate conditions to improve assembly time. Furthermore, the contact pin design incorporates gold plated contacts for maximum durability and signal integrity. The connector is also designed with a high operation temperature range of -40°C to +105°C, making it suitable for a range of applications in different environmental conditions.

The WP9-S024VA1-R6000 series is a reliable and cost-effective solution for moderating the space taken up by board-to-board connections, as well as for optimizing signal integrity and reducing design complexity. This makes the connector a great choice for applications that require the highest levels of precision and reliability, such as medical, telecommunications, and avionics applications.

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