WR-160P-VF60-N1-R1200 Connectors, Interconnects

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WR-160P-VF60-N1-R1200 is a type of rectangular connector array, edge type, mezzanine (board to board). It is a high density connector system for mezzanine card interface, designed for high reliability, mixed signal/power applications. This product is an excellent choice for any application demanding high performance and efficiency in terms of board-to-board design.

The WR-160P-VF60-N1-R1200 is a two-row, four-column (2×4) wide array configuration, which enables it to cover the needs of a large variety of applications. The contacts of the WR-160P-VF60-N1-R1200 are rated at 15 Amps (15 A), which corresponds to a continuous current rating of 0.28 Amps per contact (0.28 A/contact). This high contact current rating makes the WR-160P-VF60-N1-R1200 suitable for a wide range of power-related applications.

The WR-160P-VF60-N1-R1200 has a total of 160 mounting holes, with each row having its own location holes, allowing each row to be mounted separately. This provides added flexibility in mounting and allows for easier positioning of the components in relation to the printed circuit boards. The mounting holes can also accommodate a variety of other components, including resistors, capacitors, LEDs, and other components. The rows can be moved to different locations on the board, allowing for different card configurations. This makes it easy to change the overall configuration of the card depending on the needs of the application.

The WR-160P-VF60-N1-R1200 is designed with a special layer of insulation between the contact and the printed circuit board. This is designed to limit electrical currents to the level of the rated current. This layer of insulation also helps to reduce mechanical drift and prevent contact oxidation. The insulation layer also helps to provide a more reliable electrical connection over multiple mating cycles.

The WR-160P-VF60-N1-R1200 is available in various versions, including single and dual row configurations. The single row configuration is designed for applications requiring a single row of contact pins and is suitable for low density applications. The dual row configuration is best suited for applications requiring a more reliable contact connection, such as high density applications. In addition, this product can be used in conjunction with a variety of other connector systems, such as the WR-192P-VF60-N1-R1200, to increase the contact density in applications where higher power and signal density is required.

The WR-160P-VF60-N1-R1200 is designed to provide a secure and reliable connection between two or more printed circuit boards. This product is well-suited for a wide variety of mixed-signal, power, and high-density applications. Its high current contact rating makes it suitable for applications such as integrated boards and high-frequency boards. Additionally, the insulation layer of this product helps to improve the electrical connection and reduce mechanical drift. Its wide array of configuration options makes it a great choice for any application.

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