Broadcom i2c modulator - Allicdata Electronics

Related Categories

< 13 14 15 16 17 >

Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
1100-1154-ND	M2S050T-FGG896E S	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 896-FBGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377 Base Part Number: M2S050	1000 Order	1+: $0
M2S090S-1FG484I -ND	M2S090S-1FG484I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267 Base Part Number: M2S090S	1000 Order	1+: $0
M2S010-TQG144I- ND	M2S010-TQG144I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: 84	1000 Order	60+: $20.2608
M2S025T-FG484-N D	M2S025T-FG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267 Base Part Number: M2S025T	1000 Order	60+: $46.4148
M2S010-1VF400I- ND	M2S010-1VF400I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 195 Base Part Number: M2S010	1000 Order	90+: $27.7301
M2S010T-1FG484I -ND	M2S010T-1FG484I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 233 Base Part Number: M2S010T	1000 Order	60+: $33.1884
M2S060-1FG484-N D	M2S060-1FG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $68.9088
M2S060-1FGG484- ND	M2S060-1FGG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $68.9088
M2S150T-1FCSG53 6-ND	M2S150T-1FCSG53 6	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 536-LFBGA Supplier Device Package: 536-BGA (16x16) Number of I/O: 293	1000 Order	90+: $207.556
M2S150TS-FC1152 I-ND	M2S150TS-FC1152 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574	1000 Order	24+: $228.403
1100-1153-ND	M2S050T-FG896	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 896-FBGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377 Base Part Number: M2S050	1000 Order	1+: $0
1100-1199-ND	M2S025-VFG400I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207	2 Order	1+: $48.3903 10+: $45.4564 100+: $41.0571
M2S010-VF256-ND	M2S010-VF256	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-VFBGA Supplier Device Package: 256-BGA (17x17) Number of I/O: 138	1000 Order	119+: $19.7786
M2S025TS-FG484- ND	M2S025TS-FG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $50.4504
M2S060TS-1VFG40 0T2-ND	M2S060TS-1VFG40 0T2	Microsemi Corporation	View more Series: Automotive, AEC-Q100, SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40C ~ 125C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207	1000 Order	90+: $100.414
M2S090-FG676I-N D	M2S090-FG676I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 425	1000 Order	40+: $124.009
M2S050T-1FGG484 M-ND	M2S050T-1FGG484 M	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -55C ~ 125C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $151.81
M2S025-FCS325-N D	M2S025-FCS325	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 180	1000 Order	176+: $28.2342
M2S010-1TQ144-N D	M2S010-1TQ144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: 84	1000 Order	60+: $20.2608
M2S010T-VF400I- ND	M2S010T-VF400I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 195	1000 Order	90+: $26.7422
M2S025TS-1VF400 -ND	M2S025TS-1VF400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207	1000 Order	90+: $50.3243
M2S050T-VF400I- ND	M2S050T-VF400I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207	1000 Order	90+: $67.657
M2S060T-1FG484I -ND	M2S060T-1FG484I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $82.6973
M2S060TS-1FG676 -ND	M2S060TS-1FG676	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $86.8616
M2S005S-VFG256I -ND	M2S005S-VFG256I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 161	1000 Order	119+: $13.1293
M2S025-FG484I-N D	M2S025-FG484I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $46.7116
M2S150T-FCG1152 -ND	M2S150T-FCG1152	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S150T	1000 Order	24+: $189.546
M2S150-1FC1152I -ND	M2S150-1FC1152I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S150	1000 Order	24+: $208.321
M2S150S-1FC1152 I-ND	M2S150S-1FC1152 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S150S	1000 Order	1+: $0
M2S100-1FCG1152 I-ND	M2S100-1FCG1152 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 100K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S100	1000 Order	1+: $0
M2S100T-1FC1152 -ND	M2S100T-1FC1152	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 100K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S100T	1000 Order	1+: $0
M2S100S-1FCG115 2I-ND	M2S100S-1FCG115 2I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 100K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S100S	1000 Order	1+: $0
M2S150T-1FC1152 I-ND	M2S150T-1FC1152 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S150T	1000 Order	24+: $223.194
M2S150-1FCG1152 I-ND	M2S150-1FCG1152 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S150	1000 Order	24+: $208.321
M2S150T-1FC1152 -ND	M2S150T-1FC1152	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S150T	1000 Order	24+: $213.238
M2S150TS-1FC115 2I-ND	M2S150TS-1FC115 2I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S150TS	1000 Order	24+: $251.245
M2S150S-1FCG115 2I-ND	M2S150S-1FCG115 2I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S150S	1000 Order	1+: $0
M2S150T-FC1152- ND	M2S150T-FC1152	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S150T	1000 Order	24+: $189.546
M2S100-FCG1152- ND	M2S100-FCG1152	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 100K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S100	1000 Order	1+: $0
M2S100T-1FC1152 I-ND	M2S100T-1FC1152 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 100K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S100T	1000 Order	1+: $0

< 13 14 15 16 17 >

Hot Searches: broadcom i2c modulator broadcom led modules broadcom ic isolated module broadcom ic modulator broadcom ic modulator 16bit broadcom sensor interface broadcom led strips broadcom led lighting broadcom led cobs i2c connector modulator module ic on interface module on module ic broadcom led broadcom cpld terminal interface module industrial interface module control interface module interface module ic connector interface module

Search Result:broadcom i2c modulator

Related Categories