Chip capacitors - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
DR127D254P40M-N D	DR127D254P40M	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Connector to DIP Package Accepted: 1.27mm Header Number of Positions: 40 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.900" x 2.000" (22.86mm x 50.80mm)	29 Order	1+: $12.9087
IPC0056-ND	IPC0056	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)	1000 Order	1+: $2.6397
FPC125P020-ND	FPC125P020	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: FPC Connector Number of Positions: 20 Pitch: 0.049" (1.25mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.900" x 1.450" (22.86mm x 36.83mm)	1000 Order	1+: $3.0177
PA0141-ND	PA0141	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LLP Number of Positions: 28 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)	1000 Order	1+: $7.3017
IPC0101-ND	IPC0101	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 56 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)	1000 Order	1+: $9.9477
FPC080P030-S-ND	FPC080P030-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 30 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm) Thermal Center Pad: 0.157" L x 1.248" W (4.00mm x 31.70mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0154-S-ND	PA0154-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: BGA Number of Positions: 6 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.037" L x 0.063" W (0.95mm x 1.61mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMD6000-ND	SMD6000	Chip Quik Inc.	View more Part Status: Active Accessory Type: Solder Removal Kit	25 Order	1+: $94.5
SMD4300AX250T4- ND	SMD4300AX250T4	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Flux Type: Water Soluble Process: Leaded Form: Jar, 8.8 oz (250g) Shelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	31 Order	1+: $32.7285
SMD4300AX250T5- ND	SMD4300AX250T5	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Flux Type: Water Soluble Process: Leaded Form: Jar, 8.8 oz (250g) Shelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Weight: 0.551 lb (249.93g)	23 Order	1+: $62.3385
PA0023-S-ND	PA0023-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SSOP Number of Positions: 36 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMD291SNL15T4-N D	SMD291SNL15T4	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste, Two Part Mix Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean Process: Lead Free Form: Jar, 0.53 oz (15g) Shelf Life: 24 Months (Unmixed) Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 77F (3C ~ 25C)	15 Order	1+: $13.1985
SMD291SNL500T5C -ND	SMD291SNL500T5C	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean Process: Lead Free Form: Cartridge, 17.64 oz (500g) Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	1000 Order	1+: $134.996
PA0067-ND	PA0067	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 32 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)	97 Order	1+: $5.2857
PA0054-ND	PA0054	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: MLP, MLF Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)	1000 Order	1+: $3.6477
IPC0027-ND	IPC0027	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 44 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)	1000 Order	1+: $8.6247
SBBTH4080-1-ND	SBBTH4080-1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Proto Board Type: Breadboard, General Purpose Moisture Sensitivity Level (MSL): 1 (Unlimited) Plating: Plated Through Hole (PTH) Pitch: 0.100" (2.54mm) Circuit Pattern: Pad Per Hole (Round) Hole Diameter: 0.039" (1.00mm) Size / Dimension: 8.10" L x 4.20" W (205.7mm x 106.7mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass	103 Order	1+: $13.9167
SBB136-ND	SBB136	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Proto Board Type: Breadboard, General Purpose Plating: Plated Through Hole (PTH) Pitch: 0.100" (2.54mm) Circuit Pattern: 5 Hole Pad (Both Sides) Board Thickness: 0.062" (1.58mm) Material: FR4 Epoxy Glass	478 Order	1+: $1.512 5+: $1.4364 10+: $1.3986 25+: $1.3608 50+: $1.323 100+: $1.2474 250+: $1.1718 500+: $1.134
SMD29175G-ND	SMD29175G	Chip Quik Inc.	View more Series: CHIPQUIK Part Status: Active Type: Flux - No Clean, Tacky Solder Form: Jar, 2.65 oz (75g) Shelf Life: 24 Months Shelf Life Start: Date of Manufacture	45 Order	1+: $40.2885
PA0101-ND	PA0101	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LGA Number of Positions: 14 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)	61 Order	1+: $3.0177
PA0218-ND	PA0218	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TSOP Number of Positions: 28 Pitch: 0.022" (0.55mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)	1000 Order	1+: $4.3407
IPC0073-ND	IPC0073	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)	1000 Order	1+: $4.6557
PA0205-ND	PA0205	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to PGA Package Accepted: RQFP, QFP Number of Positions: 240 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 3.500" L x 3.500" W (88.90mm x 88.90mm)	1000 Order	1+: $13.5954
PA0040-S-ND	PA0040-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TSSOP Number of Positions: 48 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0057-S-ND	PA0057-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 8 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0058-S-ND	PA0058-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 8 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.039" L x 0.197" W (1.00mm x 5.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
HDR200MET80M-G- V-SM-ND	HDR200MET80M-G- V-SM	Chip Quik Inc.	View more Series: Proto-Advantage Packaging: Bulk Part Status: Active Connector Type: Header, Breakaway Contact Type: Male Pin Pitch - Mating: 0.079" (2.00mm) Number of Positions: 80 Number of Rows: 2 Row Spacing - Mating: 0.079" (2.00mm) Number of Positions Loaded: All Style: Board to Board Shrouding: Unshrouded Mounting Type: Surface Mount Termination: Solder Fastening Type: Push-Pull Contact Length - Mating: 0.157" (4.00mm) Insulation Height: 0.079" (2.00mm) Contact Shape: Square Contact Finish - Mating: Gold Contact Finish - Post: Gold	153 Order	1+: $1.4427
HDR127MET40M-G- RA-TH-ND	HDR127MET40M-G- RA-TH	Chip Quik Inc.	View more Series: Proto-Advantage Packaging: Bulk Part Status: Active Connector Type: Header, Breakaway Contact Type: Male Pin Pitch - Mating: 0.050" (1.27mm) Number of Positions: 40 Number of Rows: 1 Number of Positions Loaded: All Style: Board to Board Shrouding: Unshrouded Mounting Type: Through Hole, Right Angle Termination: Solder Fastening Type: Push-Pull Contact Length - Mating: 0.118" (3.00mm) Contact Length - Post: 0.071" (1.80mm) Insulation Height: 0.083" (2.10mm) Contact Shape: Square Contact Finish - Mating: Gold Contact Finish - Post: Gold	73 Order	1+: $0.9387
PA0185-ND	PA0185	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TO-263 (DDPAK/D2PAK) Number of Positions: 5 Pitch: 0.067" (1.70mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)	66 Order	1+: $3.0177
DR200D254P20F-N D	DR200D254P20F	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Connector to DIP Package Accepted: 2.00mm Header Number of Positions: 20 Pitch: 0.079" (2.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)	59 Order	1+: $5.9787
BGA0015-ND	BGA0015	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to PGA Package Accepted: BGA Number of Positions: 100 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 1.900" x 1.900" (48.26mm x 48.26mm)	1000 Order	1+: $33.0624
PCB3008-1-ND	PCB3008-1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TSSOP Number of Positions: 14 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.400" x 0.700" (10.16mm x 17.78mm)	926 Order	1+: $2.0097
CN0007-ND	CN0007	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Connector to SIP Package Accepted: USB - B Number of Positions: 4 Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)	60 Order	1+: $3.3327
IPC0127-ND	IPC0127	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)	1000 Order	1+: $3.9627
IPC0005-S-ND	IPC0005-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 14 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm) Thermal Center Pad: 0.081" L x 0.081" W (2.05mm x 2.05mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
FPC050P070-S-ND	FPC050P070-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 70 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm) Thermal Center Pad: 0.157" L x 1.685" W (4.00mm x 42.80mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0016-S-ND	IPC0016-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 28 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.157" L x 0.197" W (4.00mm x 5.00mm) Thermal Center Pad: 0.098" L x 0.138" W (2.50mm x 3.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMD2SW.0311LB-N D	SMD2SW.031 1LB	Chip Quik Inc.	View more Series: SMD2 Part Status: Active Type: Wire Solder Composition: Sn60Pb40 (60/40) Diameter: 0.031" (0.79mm) Melting Point: 361 ~ 370F (183 ~ 188C) Flux Type: No-Clean, Water Soluble Wire Gauge: 20 AWG, 22 SWG Process: Leaded Form: Spool, 1 lb (454 g) Shelf Life: Not Applicable	35 Order	1+: $24.6897 5+: $23.6628 10+: $19.547 25+: $17.4896 50+: $16.4606 100+: $15.4318
PA0001-ND	PA0001	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOIC Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)	2174 Order	1+: $2.1987
PA0007-ND	PA0007	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOIC Number of Positions: 18 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)	144 Order	1+: $2.9547

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