Embedded high-speed processor ic - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
10AS016C4U19I3L G-ND	10AS016C4U19I3L G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 160K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-UBGA (19x19) Number of I/O: 192	1000 Order	3+: $383.672
A2F200M3F-1PQG2 08I-ND	A2F200M3F-1PQG2 08I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28) Number of I/O: MCU - 22, FPGA - 66 Base Part Number: A2F200	1000 Order	1+: $0
A2F200M3F-FG256 I-ND	A2F200M3F-FG256 I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F200	1000 Order	--
10AS032H1F35I1S G-ND	10AS032H1F35I1S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35) Number of I/O: 384	1000 Order	1+: $0
M2S150-FC1152-N D	M2S150-FC1152	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S150	1000 Order	24+: $161.639
XC7Z045-3FFG900 E-ND	XC7Z045-3FFG900 E	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1GHz Primary Attributes: Kintex-7 FPGA, 350K Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 130 Base Part Number: XC7Z045	1000 Order	--
10AS016E4F29E3S G-ND	10AS016E4F29E3S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 160K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29) Number of I/O: 288	1000 Order	3+: $317.52
5ASXFB3G4F35C5N -ND	5ASXFB3G4F35C5N	Intel FPGAs/Altera	View more Series: Arria V SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: 0C ~ 85C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35) Number of I/O: MCU - 208, FPGA - 385 Base Part Number: 5ASXFB3	1000 Order	24+: $1.26
10AS066H2F34E2L G-ND	10AS066H2F34E2L G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 492	1000 Order	3+: $1.89
10AS066H2F34I2L G-ND	10AS066H2F34I2L G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 492	1000 Order	3+: $2.52
A2F200M3F-FGG48 4I-ND	A2F200M3F-FGG48 4I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: MCU - 41, FPGA - 94 Base Part Number: A2F200	1000 Order	--
XC7Z015-2CL485I -ND	XC7Z015-2CL485I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 766MHz Primary Attributes: Artix-7 FPGA, 74K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19) Number of I/O: 130	1000 Order	84+: $126.126
A2F060M3E-1TQG1 44I-ND	A2F060M3E-1TQG1 44I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: MCU - 21, FPGA - 33 Base Part Number: A2F060M3E	1000 Order	1+: $0
A2F200M3F-FG484 I-ND	A2F200M3F-FG484 I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: MCU - 41, FPGA - 94 Base Part Number: A2F200	1000 Order	--
A2F060M3E-FGG25 6-ND	A2F060M3E-FGG25 6	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
5CSEBA6U19C7N-N D	5CSEBA6U19C7N	Intel FPGAs/Altera	View more Series: Cyclone V SE Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19) Number of I/O: MCU - 151, FPGA - 66 Base Part Number: 5CSEBA6	1000 Order	84+: $119.354
10AS066K3F35I2S G-ND	10AS066K3F35I2S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35) Number of I/O: 396	1000 Order	3+: $1.89
122-1828-ND	XC7Z045-1FFG900 CES	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex-7 FPGA, 350K Logic Cells Operating Temperature: 0C ~ 85C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 130 Base Part Number: XC7Z045	1000 Order	1+: $0
10AS048K1F35E1S G-ND	10AS048K1F35E1S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35) Number of I/O: 396	1000 Order	1+: $0
XCZU2EG-1SBVA48 4E-ND	XCZU2EG-1SBVA48 4E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19) Number of I/O: 82	1000 Order	2+: $162.981
XCZU4CG-2SFVC78 4I-ND	XCZU4CG-2SFVC78 4I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	--
XCZU5EG-1FBVB90 0I-ND	XCZU5EG-1FBVB90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
122-2186-ND	XC7Z020-3CLG400 E	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 866MHz Primary Attributes: Artix-7 FPGA, 85K Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17) Number of I/O: 130 Base Part Number: XC7Z020	90 Order	--
122-2056-ND	XCZU2EG-L1SFVA6 25I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21) Number of I/O: 180	60 Order	1+: $239.967
XCZU4CG-1SFVC78 4E-ND	XCZU4CG-1SFVC78 4E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	--
XCZU5CG-L2SFVC7 84E-ND	XCZU5CG-L2SFVC7 84E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	1+: $0.63
XCZU4EG-L2FBVB9 00E-ND	XCZU4EG-L2FBVB9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $0.63
XCZU5EV-L1FBVB9 00I-ND	XCZU5EV-L1FBVB9 00I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU7EG-2FFVF15 17E-ND	XCZU7EG-2FFVF15 17E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 464	1000 Order	1+: $1.89
XCZU19EG-L1FFVC 1760I-ND	XCZU19EG-L1FFVC 1760I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 1143K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5) Number of I/O: 512	1000 Order	--
XCZU15EG-3FFVB1 156E-ND	XCZU15EG-3FFVB1 156E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 667MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 747K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 328	1000 Order	--
XC7Z010-2CLG225 E-ND	XC7Z010-2CLG225 E	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 766MHz Primary Attributes: Artix-7 FPGA, 28K Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13) Number of I/O: 86 Base Part Number: XC7Z010	1000 Order	--
XCZU2EG-2SFVC78 4E-ND	XCZU2EG-2SFVC78 4E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	1+: $246.519
XCZU4EV-2SFVC78 4E-ND	XCZU4EV-2SFVC78 4E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	--
XCZU7EG-L2FFVC1 156E-ND	XCZU7EG-L2FFVC1 156E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 360	1000 Order	1+: $1.89
122-2033-ND	XCZU9EG-1FFVC90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 599K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	6 Order	1+: $1.26
XCZU4EG-L1SFVC7 84I-ND	XCZU4EG-L1SFVC7 84I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	1+: $0.63
XCZU6EG-2FFVC90 0E-ND	XCZU6EG-2FFVC90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 469K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU15EG-1FFVB1 156I-ND	XCZU15EG-1FFVB1 156I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 747K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 328	1000 Order	--
122-2032-ND	XCZU9CG-2FFVC90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 599K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	10 Order	--

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