Embedded microcontroller ic chip - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
DR127D254P10F-N D	DR127D254P10F	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Connector to DIP Package Accepted: 1.27mm Header Number of Positions: 10 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)	144 Order	1+: $4.6557
BGA0006-ND	BGA0006	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to PGA Package Accepted: BGA Number of Positions: 484 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 3.100" x 3.800" (78.74mm x 96.52mm)	1000 Order	1+: $36.3447
PA0070-S-ND	PA0070-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 40 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
HDR100IMP20F-G- V-SM-DR-ND	HDR100IMP20F-G- V-SM-DR	Chip Quik Inc.	View more Series: Proto-Advantage Packaging: Bulk Part Status: Active Connector Type: Header Contact Type: Female Socket Style: Board to Board Number of Positions: 20 Number of Positions Loaded: All Pitch - Mating: 0.100" (2.54mm) Number of Rows: 2 Row Spacing - Mating: 0.100" (2.54mm) Mounting Type: Surface Mount Termination: Solder Fastening Type: Push-Pull Contact Finish - Mating: Gold Insulation Height: 0.205" (5.20mm) Contact Shape: Square	1000 Order	1+: $1.1277
PA0088-ND	PA0088	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SC-70, SOT-353 Number of Positions: 5 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)	201 Order	1+: $1.6947
PA0029-ND	PA0029	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QSOP Number of Positions: 20 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)	1000 Order	1+: $3.3327
IPC0141-ND	IPC0141	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: PowerSSO Number of Positions: 36 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)	1000 Order	1+: $6.6087
IPC0170-ND	IPC0170	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: BGA Number of Positions: 24 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)	1000 Order	1+: $7.6797
SBBTH1512-1-ND	SBBTH1512-1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Proto Board Type: Breadboard, General Purpose Moisture Sensitivity Level (MSL): 1 (Unlimited) Plating: Plated Through Hole (PTH) Pitch: 0.100" (2.54mm) Circuit Pattern: Pad Per Hole (Round) Hole Diameter: 0.039" (1.00mm) Size / Dimension: 1.75" L x 1.30" W (44.5mm x 33.0mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass	667 Order	1+: $1.6947
IPC0143-S-ND	IPC0143-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 16 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Thermal Center Pad: 0.106" L x 0.106" W (2.70mm x 2.70mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0051-S-ND	PA0051-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: MLP/MLF Number of Positions: 10 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.039" L x 0.197" W (1.00mm x 5.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMD291AX500T3C- ND	SMD291AX500T3C	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Flux Type: No-Clean Process: Leaded Form: Cartridge, 17.64 oz (500g) Shelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	3 Order	1+: $52.4475
SMD2SWLF.015.3O Z-ND	SMD2SWLF.015 .3 OZ	Chip Quik Inc.	View more Series: SMD2 Part Status: Active Type: Wire Solder Composition: Sn99.3Cu0.7 (99.3/0.7) Diameter: 0.015" (0.38mm) Melting Point: 441F (227C) Flux Type: No-Clean, Water Soluble Wire Gauge: 27 AWG, 28 SWG Process: Lead Free Form: Tube, 0.3 oz (8.51g) Shelf Life: Not Applicable	99 Order	1+: $12.2724 5+: $12.0242 10+: $11.5334 25+: $9.8154 50+: $8.8339 100+: $8.3431 500+: $7.3616
EPS-4126G-ND	EPS-4126G	Chip Quik Inc.	View more Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS non-compliant Type: Outlet Strip, Surge Protector Mounting Type: Bench, Wall Current - Max: 15A Region Utilized: North America Overload Protection: Circuit Breaker(s) Connector - AC Input: NEMA 5-15P Connector - AC Output: NEMA 5-15R Voltage - Input: 120V Housing Material: Steel AC Outlets: 12 Energy: 400J Cord Length: 6' (1.83m) Approvals: CSA, UL Weight: 6 lbs (2.7kg)	1000 Order	1+: $29.5785
PA0109-ND	PA0109	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TQFP, VQFP Number of Positions: 100 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 5.000" (25.40mm x 127.00mm)	65 Order	1+: $12.2787
IPC0040-ND	IPC0040	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 20 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)	1000 Order	1+: $5.2857
SMD430075G-ND	SMD430075G	Chip Quik Inc.	View more Series: CHIPQUIK Part Status: Active Type: Flux - No Clean, Water-Soluble Form: Jar, 2.65 oz (75g) Shelf Life: 24 Months Shelf Life Start: Date of Manufacture	14 Order	1+: $62.9244 5+: $56.2275 10+: $45.5175 25+: $42.84 50+: $40.1625
SMD291AX10-ND	SMD291AX10	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Flux Type: No-Clean Process: Leaded Form: Syringe, 1.23 oz (35g), 10cc Shelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Weight: 0.077 lb (34.93g)	568 Order	1+: $13.1985
SMDSWLF.0311OZ- ND	SMDSWLF.031 1OZ	Chip Quik Inc.	View more Part Status: Active Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.031" (0.79mm) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean Wire Gauge: 20 AWG, 22 SWG Process: Lead Free Form: Spool, 1 oz (28.35g) Shelf Life: Not Applicable Weight: 0.062 lb (28.12g)	141 Order	1+: $4.5864
TS391SNL10-ND	TS391SNL10	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean Process: Lead Free Form: Syringe, 1.23 oz (35g), 10cc Shelf Life: 12 Months Shelf Life Start: Date of Manufacture	47 Order	1+: $20.1285
SMDIN100-ND	SMDIN100	Chip Quik Inc.	View more Series: SMD Part Status: Active Type: Wire Solder Composition: In100 (100) Diameter: 0.031" (0.79mm) Melting Point: 315F (157C) Wire Gauge: 20 AWG, 21 SWG Process: Lead Free Form: Spool Shelf Life: Not Applicable	27 Order	1+: $19.9899 5+: $19.5804 10+: $17.9487 25+: $14.6853 50+: $13.8694 100+: $13.0536 500+: $12.2378
SMDAL200-ND	SMDAL200	Chip Quik Inc.	View more Series: SMD Part Status: Active Type: Solder Paste Composition: Sn96.5Ag3.5 (96.5/3.5) Melting Point: 430F (221C) Flux Type: Water Soluble Process: Lead Free Form: Jar, 7.05 oz (200g) Shelf Life: 12 Months Shelf Life Start: Date of Manufacture	10 Order	1+: $53.7453 5+: $48.0249 10+: $38.8773 25+: $36.5904 50+: $34.3035
IPC0082-ND	IPC0082	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)	1000 Order	1+: $5.2857
PA0226-ND	PA0226	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SSOP Number of Positions: 56 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)	1000 Order	1+: $5.9787
PA0061-S-ND	PA0061-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 16 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0170-S-ND	PA0170-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: Mini SOIC Number of Positions: 8 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.067" L x 0.315" W (1.70mm x 8.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0145-S-ND	PA0145-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LLP Number of Positions: 44 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0227-S-ND	PA0227-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SSOP Number of Positions: 48 Pitch: 0.025" (0.64mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0093-ND	PA0093	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LQFP, PQFP, TQFP, VQFP Number of Positions: 44 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)	47 Order	1+: $6.6087
PA0216-ND	PA0216	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TSOP Number of Positions: 32 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)	1000 Order	1+: $4.6557
PA0219-ND	PA0219	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Number of Positions: 52 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)	1000 Order	1+: $9.9477
HDR127MET10F-G- V-SM-DR-ND	HDR127MET10F-G- V-SM-DR	Chip Quik Inc.	View more Series: Proto-Advantage Packaging: Bulk Part Status: Active Connector Type: Header Contact Type: Female Socket Style: Board to Board Number of Positions: 10 Number of Positions Loaded: All Pitch - Mating: 0.050" (1.27mm) Number of Rows: 2 Row Spacing - Mating: 0.050" (1.27mm) Mounting Type: Surface Mount Termination: Solder Fastening Type: Push-Pull Contact Finish - Mating: Gold Insulation Height: 0.134" (3.40mm) Contact Shape: Square	1000 Order	1+: $0.6615
PA0024-ND	PA0024	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SSOP Number of Positions: 38 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)	1000 Order	1+: $4.7817
IPC0024-ND	IPC0024	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 36 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)	1000 Order	1+: $7.3017
IPC0011-S-ND	IPC0011-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 20 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0062-S-ND	IPC0062-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 8 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.079" L x 0.118" W (2.00mm x 3.00mm) Thermal Center Pad: 0.053" L x 0.057" W (1.35mm x 1.45mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0184-ND	PA0184	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TO-263 (DDPAK/D2PAK) Number of Positions: 3 Pitch: 0.100" (2.54mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)	341 Order	1+: $2.6397
PA0106SOCKET-ND	PA0106SOCKET	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)	35 Order	1+: $10.5777
F200T254P20-ND	F200T254P20	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Plated Through Hole to Plated Through Hole Number of Positions: 20 Pitch: 0.079" (2.00mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass	51 Order	1+: $2.1357
PA0055-ND	PA0055	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: MLP, MLF Number of Positions: 28 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)	1000 Order	1+: $3.9627

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