Embedded microcontroller ic chip - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
F127T254P06-ND	F127T254P06	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Plated Through Hole to Plated Through Hole Number of Positions: 6 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass	59 Order	1+: $0.9387
PA-TQFP-BB001-1 -ND	PA-TQFP-BB001-1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to PGA Package Accepted: TQFP Number of Positions: 48, 64, 80, 100 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 4.000" x 4.000" (101.60mm x 101.60mm)	31 Order	1+: $9.2547
DC1210J-10X-ND	DC1210J-10X	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to Plated Through Hole Package Accepted: 1210 Number of Positions: 2 Pitch: 0.118" (3.00mm) Material: FR4 Epoxy Glass Size / Dimension: 0.400" L x 0.200" W (10.16mm x 5.08mm)	98 Order	1+: $3.4713 5+: $3.3806 10+: $3.2886 25+: $3.1974 50+: $3.0146 100+: $2.9232 250+: $2.7405
PA0044-ND	PA0044	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: VSOP Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)	1000 Order	1+: $2.0097
IPC0010-ND	IPC0010	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)	1000 Order	1+: $5.2857
PA0235-ND	PA0235	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LQFP Number of Positions: 40 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)	1000 Order	1+: $6.2937
PA0105-ND	PA0105	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)	1000 Order	1+: $6.6087
FPC040P090-ND	FPC040P090	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: FPC Connector Number of Positions: 90 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.100" x 4.550" (27.94mm x 115.57mm)	1000 Order	1+: $7.6167
BGA0004-ND	BGA0004	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to PGA Package Accepted: BGA Number of Positions: 100 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.900" x 2.100" (48.26mm x 53.34mm)	1000 Order	1+: $16.4997
IPC0086-ND	IPC0086	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)	1000 Order	1+: $3.3327
IPC0124-ND	IPC0124	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)	1000 Order	1+: $3.9627
IPC0159-ND	IPC0159	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 22 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm)	1000 Order	1+: $6.2811
MPH100IMP40M-G- V-SP-ND	MPH100IMP40M-G- V-SP	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active	130 Order	1+: $1.3167
PA0013-S-ND	PA0013-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SOIC Number of Positions: 48 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0064-S-ND	IPC0064-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 8 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.057" L x 0.069" W (1.45mm x 1.75mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0031-S-ND	PA0031-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QSOP Number of Positions: 28 Pitch: 0.025" (0.64mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0090-S-ND	PA0090-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TSOC Number of Positions: 6 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0050-S-ND	IPC0050-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: PowerSOIC Number of Positions: 10 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.295" L x 0.370" W (7.50mm x 9.40mm) Thermal Center Pad: 0.291" L x 0.413" W (7.40mm x 10.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0155-S-ND	IPC0155-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 12 Pitch: 0.016" (0.40mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.066" L x 0.087" W (1.68mm x 2.20mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $8.1459
SMD3SW.0318OZ-N D	SMD3SW.031 8OZ	Chip Quik Inc.	View more Series: SMD3 Part Status: Active Type: Wire Solder Composition: Sn62Pb36Ag2 (62/36/2) Diameter: 0.031" (0.79mm) Melting Point: 354F (179C) Flux Type: No-Clean, Water Soluble Wire Gauge: 20 AWG, 22 SWG Process: Leaded Form: Spool, 8 oz (227g), 1/2 lb Shelf Life: Not Applicable	100 Order	1+: $15.0759
IPC0086-S-ND	IPC0086-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 8 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm) Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
FPC100P020-S-ND	FPC100P020-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 20 Pitch: 0.039" (1.00mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Thermal Center Pad: 0.157" L x 1.167" W (4.00mm x 29.65mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0138-S-ND	IPC0138-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TQFP Number of Positions: 64 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0026-ND	PA0026	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: MSOP, uMAX, uSOP Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)	821 Order	1+: $2.1987
F200T254P10-ND	F200T254P10	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Plated Through Hole to Plated Through Hole Number of Positions: 10 Pitch: 0.079" (2.00mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass	84 Order	1+: $1.1907
IPC0050-ND	IPC0050	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: PowerSOIC, PSOP, HSOP Number of Positions: 10 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)	1000 Order	1+: $3.6477
PA0069-S-ND	PA0069-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 36 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0157-S-ND	PA0157-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: BGA Number of Positions: 10 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.089" L x 0.098" W (2.25mm x 2.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMD291AX10T5-ND	SMD291AX10T5	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Flux Type: No-Clean Process: Leaded Form: Syringe, 1.23 oz (35g), 10cc Shelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Weight: 0.077 lb (34.93g)	125 Order	1+: $18.8685
SMDSWLF.0312OZ- ND	SMDSWLF.031 2OZ	Chip Quik Inc.	View more Part Status: Active Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.031" (0.79mm) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean Wire Gauge: 20 AWG, 22 SWG Process: Lead Free Form: Spool, 2 oz (56.70g) Shelf Life: Not Applicable Weight: 0.125 lb (56.7g)	299 Order	1+: $7.2765
SMD4300AX500T4C -ND	SMD4300AX500T4C	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Flux Type: Water Soluble Process: Leaded Form: Cartridge, 17.64 oz (500g) Shelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	1000 Order	1+: $61.425
PA0009-ND	PA0009	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOIC Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)	244 Order	1+: $3.3327
PA0076-ND	PA0076	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TVSOP Number of Positions: 16 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)	1000 Order	1+: $2.6397
IPC0175-ND	IPC0175	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 2 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)	1000 Order	1+: $5.8653
PA0211-ND	PA0211	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TSOP Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)	1000 Order	1+: $5.9787
1962-1008-ND	EC-VA-H264-10B- 60-1080-MXC-ZL	System-On-Chip (SOC) Technologies Inc.	View more Series: H.264-HD Encoder Part Status: Active Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.7" x 2.0" (68mm x 51mm) Operating Temperature: 0C ~ 85C	1000 Order	1+: $0.63 5+: $0.63 10+: $545.076
1962-1016-ND	DC-VA-H264-10B- 30-1080-MXC-ZL	System-On-Chip (SOC) Technologies Inc.	View more Series: H.264-HD Decoder Part Status: Active Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.7" x 2.0" (68mm x 51mm) Operating Temperature: 0C ~ 85C	1000 Order	1+: $0.63 5+: $566.371 10+: $449.064
EC-VA-H264-10B- 30-1080-MXC-SL-ND	EC-VA-H264-10B- 30-1080-MXC-SL	System-On-Chip (SOC) Technologies Inc.	View more Series: H.264-HD Encoder Part Status: Active Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.7" x 2.0" (68mm x 51mm) Operating Temperature: 0C ~ 85C	1000 Order	5+: $427.77
EC-V-H264-8B-60 -1080-MXC-SL-ND	EC-V-H264-8B-60 -1080-MXC-SL	System-On-Chip (SOC) Technologies Inc.	View more Series: H.264-HD Encoder Part Status: Active Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.7" x 2.0" (68mm x 51mm) Operating Temperature: 0C ~ 85C	1000 Order	5+: $427.77
EC-V-H264-8B-60 -1080-MXC-LL-ND	EC-V-H264-8B-60 -1080-MXC-LL	System-On-Chip (SOC) Technologies Inc.	View more Series: H.264-HD Encoder Part Status: Active Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.7" x 2.0" (68mm x 51mm) Operating Temperature: 0C ~ 85C	1000 Order	5+: $471.871

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