Processor ic chip - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
M2S060TS-FG676- ND	M2S060TS-FG676	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $78.1767
M2S090TS-1FCS32 5I-ND	M2S090TS-1FCS32 5I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 180	1000 Order	176+: $101.581
1100-1218-ND	M2S010T-VFG400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 195 Base Part Number: M2S010T	1000 Order	90+: $23.7686
M2S025T-1VF256I -ND	M2S025T-1VF256I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-VFBGA Supplier Device Package: 256-BGA (17x17) Number of I/O: 138	1000 Order	119+: $48.7081
M2S050-1FCS325- ND	M2S050-1FCS325	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 200	1000 Order	176+: $51.5573
M2S060T-FGG676- ND	M2S060T-FGG676	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $69.4909
M2S060TS-FGG484 -ND	M2S060TS-FGG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $74.4296
M2S050T-1FGG484 I-ND	M2S050T-1FGG484 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267 Base Part Number: M2S050T	1000 Order	60+: $78.7591
M2S060TS-FGG484 I-ND	M2S060TS-FGG484 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $82.6973
M2S050-1FGG896I -ND	M2S050-1FGG896I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 896-FBGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377 Base Part Number: M2S050	1000 Order	27+: $85.9432
M2S150T-FCS536- ND	M2S150T-FCS536	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 536-LFBGA Supplier Device Package: 536-BGA (16x16) Number of I/O: 293	1000 Order	90+: $184.498
M2S150TS-FCV484 -ND	M2S150TS-FCV484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BFBGA Supplier Device Package: 484-BGA Number of I/O: 273	1000 Order	84+: $193.705
M2S025-FCSG325I -ND	M2S025-FCSG325I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 180	1000 Order	176+: $35.2973
M2S050-1FCSG325 I-ND	M2S050-1FCSG325 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 200	1000 Order	176+: $57.7404
M2S050-1FG484I- ND	M2S050-1FG484I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267 Base Part Number: M2S050	1000 Order	60+: $73.5077
M2S090T-1FCSG32 5I-ND	M2S090T-1FCSG32 5I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 180	1000 Order	176+: $92.3419
M2S005S-1VFG400 -ND	M2S005S-1VFG400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 171	1000 Order	90+: $14.7263
M2S005S-1FGG484 I-ND	M2S005S-1FGG484 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 209 Base Part Number: M2S005S	1000 Order	60+: $18.8817
M2S010-1FG484I- ND	M2S010-1FG484I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 233 Base Part Number: M2S010	1000 Order	60+: $30.9771
M2S025-1VFG400- ND	M2S025-1VFG400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 Base Part Number: M2S025	1000 Order	90+: $43.4032
M2S025TS-VFG256 I-ND	M2S025TS-VFG256 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $48.7081
M2S060T-FGG676I -ND	M2S060T-FGG676I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $78.1767
M2S090-FCS325I- ND	M2S090-FCS325I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 180	1000 Order	176+: $78.729
M2S005S-1FG484- ND	M2S005S-1FG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 209	1000 Order	60+: $17.061
M2S060-FGG484-N D	M2S060-FGG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $57.1261
M2S010TS-1VFG25 6T2-ND	M2S010TS-1VFG25 6T2	Microsemi Corporation	View more Series: Automotive, AEC-Q100, SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 125C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $33.2612
M2S060T-1VF400- ND	M2S060T-1VF400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207	1000 Order	90+: $71.0388
M2S060T-FG676I- ND	M2S060T-FG676I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $78.1767
M2S060TS-FGG676 -ND	M2S060TS-FGG676	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $78.1767
M2S090TS-FGG484 -ND	M2S090TS-FGG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $121.429
M2S025-VF400I-N D	M2S025-VF400I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207	1000 Order	90+: $43.4032
M2S150-FCV484-N D	M2S150-FCV484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BFBGA Supplier Device Package: 484-BGA Number of I/O: 273	1000 Order	84+: $143.482
M2S150TS-1FCVG4 84-ND	M2S150TS-1FCVG4 84	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BFBGA Supplier Device Package: 484-BGA Number of I/O: 273	1000 Order	84+: $207.141
M2S010-1VFG400- ND	M2S010-1VFG400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 195 Base Part Number: M2S010	1000 Order	90+: $24.7666
M2S010TS-1VFG40 0I-ND	M2S010TS-1VFG40 0I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 195 Base Part Number: M2S010TS	1000 Order	90+: $31.6292
M2S025-VFG256I- ND	M2S025-VFG256I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $42.089
M2S060TS-1FCSG3 25I-ND	M2S060TS-1FCSG3 25I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 200	1000 Order	176+: $67.049
M2S090T-1FG676- ND	M2S090T-1FG676	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 425 Base Part Number: M2S090T	1000 Order	40+: $133.93
M2S060TS-1FG484 -ND	M2S060TS-1FG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $82.6973
M2S025T-1VF256- ND	M2S025T-1VF256	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-VFBGA Supplier Device Package: 256-BGA (17x17) Number of I/O: 138	1000 Order	119+: $43.8348

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