Processor ic chip - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
SMD291SNL500T3- ND	SMD291SNL500T3	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean Process: Lead Free Form: Jar, 17.64 oz (500g) Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	1000 Order	1+: $64.2285
PA0015-ND	PA0015	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SSOP Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)	1000 Order	1+: $2.1987
PA0098-ND	PA0098	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LGA Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)	1000 Order	1+: $2.6397
PA0146-ND	PA0146	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LLP Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)	1000 Order	1+: $10.5777
IPC0027-S-ND	IPC0027-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 44 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Thermal Center Pad: 0.130" L x 0.130" W (3.30mm x 3.30mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0083-S-ND	IPC0083-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 6 Pitch: 0.037" (0.95mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.059" L x 0.091" W (1.50mm x 2.30mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0097-S-ND	IPC0097-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 48 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.354" L x 0.354" W (9.00mm x 9.00mm) Thermal Center Pad: 0.268" L x 0.268" W (6.80mm x 6.80mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMDLTLFP60T4-ND	SMDLTLFP60T4	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste, Two Part Mix Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Melting Point: 281F (138C) Flux Type: No-Clean Process: Lead Free Form: Jar, 2.12 oz (60g) Shelf Life: 24 Months (Unmixed) Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 77F (3C ~ 25C)	27 Order	1+: $25.7985
PA0047-ND	PA0047	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: VSOP Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)	1000 Order	1+: $3.3327
F127T254P08-ND	F127T254P08	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Plated Through Hole to Plated Through Hole Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass	137 Order	1+: $1.0647
IPC0048-ND	IPC0048	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: PowerSOIC, PSOP, HSOP Number of Positions: 24 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)	62 Order	1+: $5.6637
SBBTH1508-1-ND	SBBTH1508-1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Proto Board Type: Breadboard, General Purpose Moisture Sensitivity Level (MSL): 1 (Unlimited) Plating: Plated Through Hole (PTH) Pitch: 0.100" (2.54mm) Circuit Pattern: Pad Per Hole (Round) Hole Diameter: 0.039" (1.00mm) Size / Dimension: 1.75" L x 0.90" W (44.5mm x 22.9mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass	1578 Order	1+: $1.0017
PA0067-S-ND	PA0067-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 32 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0194-S-ND	PA0194-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TSSOP Number of Positions: 20 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.173" L x 0.256" W (4.40mm x 6.50mm) Thermal Center Pad: 0.118" L x 0.492" W (3.00mm x 12.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0037-S-ND	IPC0037-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 12 Pitch: 0.016" (0.40mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.087" L x 0.055" W (2.20mm x 1.40mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0122-S-ND	PA0122-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LQFP Number of Positions: 128 Pitch: 0.020" (0.50mm) Outer Dimension: 1.350" L x 1.950" W (34.29mm x 49.53mm) Inner Dimension: 0.787" L x 0.787" W (20.00mm x 20.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $8.1459
SMD291AX250T3-N D	SMD291AX250T3	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Flux Type: No-Clean Process: Leaded Form: Jar, 8.8 oz (250g) Shelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Weight: 0.551 lb (249.93g)	271 Order	1+: $26.4285
SMD2215-25000-N D	SMD2215-25000	Chip Quik Inc.	View more Series: SMD2 Part Status: Active Type: Solder Sphere Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Process: Leaded Form: Jar Shelf Life: 24 Months Shelf Life Start: Date of Manufacture	7 Order	1+: $16.0524 5+: $15.7248 10+: $14.4144 25+: $11.7936 50+: $11.1384 100+: $10.4832 500+: $9.828
SMDLTLFP500T4C- ND	SMDLTLFP500T4C	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Melting Point: 281F (138C) Flux Type: No-Clean Process: Lead Free Form: Cartridge, 17.64 oz (500g) Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	1000 Order	1+: $99.225
DC1210S-10X-ND	DC1210S-10X	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: 1210 Number of Positions: 2 Board Thickness: 0.031" (0.79mm) 1/32" Material: FR4 Epoxy Glass Size / Dimension: 0.400" x 0.400" (10.16mm x 10.16mm)	44 Order	1+: $3.087
PA0012-ND	PA0012	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOIC Number of Positions: 32 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)	1000 Order	1+: $4.0257
IPC0146-ND	IPC0146	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)	1000 Order	1+: $9.9477
SMDSG10CCR-ND	SMDSG10CCR	Chip Quik Inc.	View more Series: CHIPQUIK Part Status: Active Accessory Type: Syringe Gun, Manual Tip - Type: Needle Tip Capacity: 10cc Number of Pieces: 1	54 Order	1+: $40.95
IPC0014-S-ND	IPC0014-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 24 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	33 Order	1+: $7.56
PA0017-S-ND	PA0017-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SSOP Number of Positions: 16 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0063-S-ND	IPC0063-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 8 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.055" L x 0.091" W (1.40mm x 2.30mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0110-S-ND	IPC0110-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 16 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm) Thermal Center Pad: 0.084" L x 0.084" W (2.14mm x 2.14mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
FPC125P020-S-ND	FPC125P020-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 20 Pitch: 0.049" (1.25mm) Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm) Thermal Center Pad: 0.157" L x 1.364" W (4.00mm x 34.65mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0111-S-ND	IPC0111-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: HSOP Number of Positions: 44 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.630" L x 0.433" W (16.00mm x 11.00mm) Thermal Center Pad: 0.270" L x 0.630" W (6.85mm x 16.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMDSWLF.0201OZ- ND	SMDSWLF.020 1OZ	Chip Quik Inc.	View more Part Status: Active Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.020" (0.51mm) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean Wire Gauge: 24 AWG, 25 SWG Process: Lead Free Form: Spool, 1 oz (28.35g) Shelf Life: Not Applicable Weight: 0.062 lb (28.12g)	165 Order	1+: $4.8573
TS391SNL250-ND	TS391SNL250	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean Process: Lead Free Form: Jar, 8.8 oz (250g) Shelf Life: 12 Months Shelf Life Start: Date of Manufacture	11 Order	1+: $44.0685
SMD2SWLF.0318OZ -ND	SMD2SWLF.031 8O Z	Chip Quik Inc.	View more Series: SMD2 Part Status: Active Type: Wire Solder Composition: Sn99.3Cu0.7 (99.3/0.7) Diameter: 0.031" (0.79mm) Melting Point: 441F (227C) Flux Type: No-Clean, Water Soluble Wire Gauge: 20 AWG, 22 SWG Process: Lead Free Form: Spool, 8 oz (227g), 1/2 lb Shelf Life: Not Applicable	1 Order	1+: $12.6945
SMDSWLF.0311LB- ND	SMDSWLF.031 1LB	Chip Quik Inc.	View more Part Status: Active Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.031" (0.79mm) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean, Water Soluble Wire Gauge: 20 AWG, 22 SWG Process: Lead Free Form: Spool, 1 lb (454 g) Shelf Life: Not Applicable	2 Order	1+: $63.1449 5+: $56.4266 10+: $45.6782 25+: $42.9912 50+: $40.3042
PA0180-ND	PA0180	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SuperSOT, TSOT Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)	111 Order	1+: $2.0097
PA0183-ND	PA0183	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TO-252 (DPAK) Number of Positions: 3 Pitch: 0.091" (2.30mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)	131 Order	1+: $2.3247
IPC0090-ND	IPC0090	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LGA Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)	1000 Order	1+: $3.9627
IPC0182-ND	IPC0182	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LGA Number of Positions: 10 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)	1000 Order	1+: $4.1517
PCB3001-1-ND	PCB3001-1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOIC, SOP Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.800" x 1.400" (20.32mm x 35.56mm)	481 Order	1+: $2.0097
IPC0005-ND	IPC0005	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 14 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)	1000 Order	1+: $4.6557
IPC0091-ND	IPC0091	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: PowerSSO Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)	1000 Order	1+: $5.9787

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