Processor ic chip - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
EPS-3096G-ND	EPS-3096G	Chip Quik Inc.	View more Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS non-compliant Type: Outlet Strip, Surge Protector Mounting Type: Bench, Wall Current - Max: 15A Region Utilized: North America Overload Protection: Circuit Breaker(s) Connector - AC Input: NEMA 5-15P Connector - AC Output: NEMA 5-15R Voltage - Input: 120V Housing Material: Steel AC Outlets: 9 Energy: 400J Cord Length: 6' (1.83m) Approvals: CSA, UL	1000 Order	1+: $28.9485
IPC0119-ND	IPC0119	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)	1000 Order	1+: $2.6397
PA0078-ND	PA0078	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TVSOP Number of Positions: 24 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)	1000 Order	1+: $3.3327
IPC0114-ND	IPC0114	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: PowerSSO Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)	1000 Order	1+: $5.9787
IPC0043-ND	IPC0043	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 32 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)	1000 Order	1+: $6.6087
PCB3008-1-ND	PCB3008-1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TSSOP Number of Positions: 14 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.400" x 0.700" (10.16mm x 17.78mm)	926 Order	1+: $2.0097
CN0007-ND	CN0007	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Connector to SIP Package Accepted: USB - B Number of Positions: 4 Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)	60 Order	1+: $3.3327
IPC0127-ND	IPC0127	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)	1000 Order	1+: $3.9627
IPC0005-S-ND	IPC0005-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 14 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm) Thermal Center Pad: 0.081" L x 0.081" W (2.05mm x 2.05mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
FPC050P070-S-ND	FPC050P070-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 70 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm) Thermal Center Pad: 0.157" L x 1.685" W (4.00mm x 42.80mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0016-S-ND	IPC0016-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 28 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.157" L x 0.197" W (4.00mm x 5.00mm) Thermal Center Pad: 0.098" L x 0.138" W (2.50mm x 3.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMD2SW.0311LB-N D	SMD2SW.031 1LB	Chip Quik Inc.	View more Series: SMD2 Part Status: Active Type: Wire Solder Composition: Sn60Pb40 (60/40) Diameter: 0.031" (0.79mm) Melting Point: 361 ~ 370F (183 ~ 188C) Flux Type: No-Clean, Water Soluble Wire Gauge: 20 AWG, 22 SWG Process: Leaded Form: Spool, 1 lb (454 g) Shelf Life: Not Applicable	35 Order	1+: $24.6897 5+: $23.6628 10+: $19.547 25+: $17.4896 50+: $16.4606 100+: $15.4318
PA0061-ND	PA0061	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)	174 Order	1+: $3.0177
PA0169-ND	PA0169	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: MiniSOIC Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)	1000 Order	1+: $2.3247
PA0099-ND	PA0099	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LGA Number of Positions: 16 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)	1000 Order	1+: $3.9627
IPC0075-ND	IPC0075	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 18 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.100" (25.40mm x 27.94mm)	1000 Order	1+: $4.9707
IPC0031-ND	IPC0031	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)	1000 Order	1+: $9.9477
HDR100IMP40F-G- RA-TH-ND	HDR100IMP40F-G- RA-TH	Chip Quik Inc.	View more Series: Proto-Advantage Packaging: Bulk Part Status: Active Connector Type: Header Contact Type: Female Socket Style: Board to Board Number of Positions: 40 Number of Positions Loaded: All Pitch - Mating: 0.100" (2.54mm) Number of Rows: 1 Mounting Type: Through Hole, Right Angle Termination: Solder Fastening Type: Push-Pull Contact Finish - Mating: Gold Insulation Height: 0.098" (2.50mm) Contact Length - Post: 0.126" (3.20mm) Contact Shape: Square	522 Order	1+: $0.5607
PA0107-S-ND	PA0107-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: PLCC/JLCC Number of Positions: 44 Pitch: 0.050" (1.27mm) Outer Dimension: 1.350" L x 1.950" W (34.29mm x 49.53mm) Inner Dimension: 0.689" L x 0.689" W (17.50mm x 17.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0045-S-ND	IPC0045-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 46 Pitch: 0.016" (0.40mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.157" L x 0.276" W (4.00mm x 7.00mm) Thermal Center Pad: 0.098" L x 0.217" W (2.50mm x 5.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0055-S-ND	PA0055-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: MLP/MLF Number of Positions: 28 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
CN0030-ND	CN0030	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Connector to SIP Package Accepted: DB9 Number of Positions: 9 Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.400" x 1.200" (10.16mm x 30.48mm)	103 Order	1+: $3.3327
IPC0044-ND	IPC0044	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 40 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)	1000 Order	1+: $7.9317
SMD291ST8CC-ND	SMD291ST8CC	Chip Quik Inc.	View more Series: CHIPQUIK Part Status: Active Type: Flux - No Clean, Tacky Solder Form: Tube, 0.28 oz (8g), 8cc Shelf Life: 24 Months Shelf Life Start: Date of Manufacture	107 Order	1+: $8.1585
PA0103-S-ND	PA0103-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LGA Number of Positions: 16 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	5 Order	1+: $7.56
PA0106-S-ND	PA0106-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: PLCC/JLCC Number of Positions: 28 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.492" L x 0.492" W (12.50mm x 12.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0229-S-ND	PA0229-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TSOP Number of Positions: 56 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMD291AX50T3-ND	SMD291AX50T3	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Flux Type: No-Clean Process: Leaded Form: Jar, 1.76 oz (50g) Shelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Weight: 0.113 lb (51.26g)	421 Order	1+: $8.1774
SMDN-25G-ND	SMDN-25G	Chip Quik Inc.	View more Part Status: Active Accessory Type: Dispenser Needle, Tip Tip - Type: Needle Tip Gauge: 25 Number of Pieces: 100	30 Order	1+: $13.8159 5+: $13.4102 10+: $13.0032 25+: $12.1905
BGA0019-S-ND	BGA0019-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: BGA Number of Positions: 36 Pitch: 0.016" (0.40mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	19 Order	1+: $13.2237
PA0188-S-ND	PA0188-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TQFP Number of Positions: 144 Pitch: 0.020" (0.50mm) Outer Dimension: 1.350" L x 1.950" W (34.29mm x 49.53mm) Inner Dimension: 0.787" L x 0.787" W (20.00mm x 20.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	14 Order	1+: $7.56
IPC0141-S-ND	IPC0141-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: PowerSSO Number of Positions: 36 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.407" L x 0.295" W (10.35mm x 7.50mm) Thermal Center Pad: 0.185" L x 0.217" W (4.70mm x 5.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMDSW.0312OZ-ND	SMDSW.031 2OZ	Chip Quik Inc.	View more Part Status: Active Type: Wire Solder Composition: Sn63Pb37 (63/37) Diameter: 0.031" (0.79mm) Melting Point: 361F (183C) Flux Type: No-Clean, Water Soluble Wire Gauge: 20 AWG, 22 SWG Process: Leaded Form: Spool, 2 oz (56.70g) Shelf Life: Not Applicable Weight: 0.125 lb (56.7g)	39 Order	1+: $3.969
PA0065-ND	PA0065	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 28 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)	96 Order	1+: $4.6557
PA0084-ND	PA0084	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOT-89 Number of Positions: 4 Pitch: 0.059" (1.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)	1000 Order	1+: $2.0097
IPC0106-ND	IPC0106	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 14 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)	1000 Order	1+: $3.9627
IPC0157-ND	IPC0157	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 10 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)	1000 Order	1+: $4.1517
PA0006-S-ND	PA0006-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SOIC Number of Positions: 16 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0073-S-ND	PA0073-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 48 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0019-S-ND	IPC0019-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 32 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.157" L x 0.236" W (4.00mm x 6.00mm) Thermal Center Pad: 0.098" L x 0.177" W (2.50mm x 4.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017

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