Usb earphone pcm2706 - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
M2S005S-TQ144I- ND	M2S005S-TQ144I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: 84	1000 Order	60+: $12.1987
M2S025TS-VF400- ND	M2S025TS-VF400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207	1000 Order	90+: $45.2882
M2S025TS-FGG484 I-ND	M2S025TS-FGG484 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $56.054
M2S060T-1FGG676 -ND	M2S060T-1FGG676	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $78.1767
M2S150-FC1152I- ND	M2S150-FC1152I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	1000 Order	1+: $217.19
10AS048H2F34E2S G-ND	10AS048H2F34E2S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Number of I/O: 492	1000 Order	3+: $1.26
10AS048K2F35I2L G-ND	10AS048K2F35I2L G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 396	1000 Order	3+: $2.52
M2S005S-TQG144I -ND	M2S005S-TQG144I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: 84	1000 Order	60+: $12.1987
M2S025T-1FG484- ND	M2S025T-1FG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267 Base Part Number: M2S025T	1000 Order	60+: $50.4504
M2S090TS-FCSG32 5-ND	M2S090TS-FCSG32 5	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 180	1000 Order	176+: $83.1124
1SX280LU3F50I1V G-ND	1SX280LU3F50I1V G	Intel FPGAs/Altera	View more Series: Stratix 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 704	1000 Order	3+: $21.42
1SX280LH2F55I1V G-ND	1SX280LH2F55I1V G	Intel FPGAs/Altera	View more Series: Stratix 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 1160	1000 Order	3+: $21.42
M2S050T-1FG484I -ND	M2S050T-1FG484I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267 Base Part Number: M2S050T	1000 Order	60+: $78.7591
M2S050T-1FGG896 -ND	M2S050T-1FGG896	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 896-FBGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377 Base Part Number: M2S050T	1000 Order	27+: $85.9922
10AS027H2F34I2L G-ND	10AS027H2F34I2L G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 384	1000 Order	3+: $0.63
10AS048K4F35E3L G-ND	10AS048K4F35E3L G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Number of I/O: 396	1000 Order	3+: $1.26
M2S025TS-1VFG40 0T2-ND	M2S025TS-1VFG40 0T2	Microsemi Corporation	View more Series: Automotive, AEC-Q100, SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40C ~ 125C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207	1000 Order	90+: $66.4322
M2S060T-1VFG400 -ND	M2S060T-1VFG400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207	1000 Order	90+: $71.0388
1SX250LH2F55I2V G-ND	1SX250LH2F55I2V G	Intel FPGAs/Altera	View more Series: Stratix 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 1160	1000 Order	3+: $16.38
M2S010S-TQG144- ND	M2S010S-TQG144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Number of I/O: 84	1000 Order	60+: $20.9765
M2S025-1FCSG325 -ND	M2S025-1FCSG325	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 180	1000 Order	176+: $35.2973
10AS027H3F34E2L G-ND	10AS027H3F34E2L G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Number of I/O: 384	1000 Order	3+: $0.63
10AS048E3F29E2L G-ND	10AS048E3F29E2L G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Number of I/O: 360	1000 Order	3+: $1.26
1SX250LH2F55I2L G-ND	1SX250LH2F55I2L G	Intel FPGAs/Altera	View more Series: Stratix 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 1160	1000 Order	3+: $20.79
M2S025T-VF400I- ND	M2S025T-VF400I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207	1000 Order	90+: $45.2882
M2S050T-1FG484- ND	M2S050T-1FG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267 Base Part Number: M2S050T	1000 Order	60+: $70.882
1SX250LU2F50E1V G-ND	1SX250LU2F50E1V G	Intel FPGAs/Altera	View more Series: Stratix 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Number of I/O: 704	1000 Order	3+: $19.53
M2S005-VFG256I- ND	M2S005-VFG256I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LFBGA Supplier Device Package: 256-VFPBGA (14x14) Number of I/O: 161	780 Order	119+: $11.3575
M2S005-TQ144I-N D	M2S005-TQ144I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: 84	1000 Order	60+: $11.4801
M2S025T-FCS325I -ND	M2S025T-FCS325I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 180	1000 Order	176+: $37.3262
M2S025TS-1FCSG3 25-ND	M2S025TS-1FCSG3 25	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 180	1000 Order	176+: $41.4716
M2S060-1FGG484I -ND	M2S060-1FGG484I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $77.1848
1SX280LH3F55E3V G-ND	1SX280LH3F55E3V G	Intel FPGAs/Altera	View more Series: Stratix 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Number of I/O: 1160	1000 Order	3+: $10.71
M2S005-TQG144-N D	M2S005-TQG144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: 84	1000 Order	60+: $10.1048
M2S010-VFG256-N D	M2S010-VFG256	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $19.7786
M2S050T-FCSG325 -ND	M2S050T-FCSG325	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 200	1000 Order	176+: $49.4991
M2S060T-1FG484- ND	M2S060T-1FG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $74.4296
M2S060TS-1FG676 I-ND	M2S060TS-1FG676 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $92.085
M2S050T-1FG896I -ND	M2S050T-1FG896I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 896-FBGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377 Base Part Number: M2S050T	1000 Order	27+: $92.085
M2S150-FCS536-N D	M2S150-FCS536	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 536-LFBGA Supplier Device Package: 536-BGA (16x16) Number of I/O: 293	1000 Order	90+: $165.008

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