Voltage controlled variable resistor chip

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
PA0078-ND	PA0078	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TVSOP Number of Positions: 24 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)	1000 Order	1+: $3.3327
IPC0114-ND	IPC0114	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: PowerSSO Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)	1000 Order	1+: $5.9787
IPC0043-ND	IPC0043	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 32 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)	1000 Order	1+: $6.6087
IPC0060-S-ND	IPC0060-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 8 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0133-S-ND	PA0133-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LLP Number of Positions: 6 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.087" L x 0.098" W (2.20mm x 2.50mm) Thermal Center Pad: 0.030" L x 0.197" W (0.75mm x 5.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0182-S-ND	IPC0182-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LGA Number of Positions: 10 Pitch: 0.016" (0.40mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.061" L x 0.045" W (1.55mm x 1.15mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $8.1459
SMDSWLF.00850G- ND	SMDSWLF.008 50G	Chip Quik Inc.	View more Series: SMD Part Status: Active Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.008" (0.20mm) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean, Water Soluble Wire Gauge: 32 AWG, 35 SWG Process: Lead Free Form: Spool, 1.76 oz (50g) Shelf Life: Not Applicable	35 Order	1+: $69.2748 5+: $61.9038 10+: $50.1121 25+: $47.1643 50+: $44.2165
TS391LT500C-ND	TS391LT500C	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Melting Point: 281F (138C) Flux Type: No-Clean Process: Lead Free Form: Cartridge, 17.64 oz (500g) Shelf Life: 12 Months Shelf Life Start: Date of Manufacture	4 Order	1+: $99.792
SMD4300SNL250T4 -ND	SMD4300SNL250T4	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: Water Soluble Process: Lead Free Form: Jar, 8.8 oz (250g) Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Weight: 0.551 lb (249.93g)	3 Order	1+: $42.8085
PA0040-S-ND	PA0040-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TSSOP Number of Positions: 48 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0057-S-ND	PA0057-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 8 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0058-S-ND	PA0058-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 8 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.039" L x 0.197" W (1.00mm x 5.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0185-ND	PA0185	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TO-263 (DDPAK/D2PAK) Number of Positions: 5 Pitch: 0.067" (1.70mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)	66 Order	1+: $3.0177
DR200D254P20F-N D	DR200D254P20F	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Connector to DIP Package Accepted: 2.00mm Header Number of Positions: 20 Pitch: 0.079" (2.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)	59 Order	1+: $5.9787
BGA0015-ND	BGA0015	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to PGA Package Accepted: BGA Number of Positions: 100 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 1.900" x 1.900" (48.26mm x 48.26mm)	1000 Order	1+: $33.0624
SBBTH1520-1-ND	SBBTH1520-1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Proto Board Type: Breadboard, General Purpose Moisture Sensitivity Level (MSL): 1 (Unlimited) Plating: Plated Through Hole (PTH) Pitch: 0.100" (2.54mm) Circuit Pattern: Pad Per Hole (Round) Hole Diameter: 0.039" (1.00mm) Size / Dimension: 2.10" L x 1.75" W (53.3mm x 44.5mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass	696 Order	1+: $2.3247
SMD291NL75G-ND	SMD291NL75G	Chip Quik Inc.	View more Series: CHIPQUIK Part Status: Active Type: Flux - No Clean, Lead Free, Tacky Solder Form: Jar, 2.65 oz (75g) Shelf Life: 24 Months Shelf Life Start: Date of Manufacture	22 Order	1+: $63.6615 5+: $56.889 10+: $46.053 25+: $43.344 50+: $40.635
IPC0007-S-ND	IPC0007-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 16 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0172-S-ND	IPC0172-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 8 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.236" L x 0.315" W (6.00mm x 8.00mm) Thermal Center Pad: 0.134" L x 0.169" W (3.40mm x 4.30mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $8.1459
SMDLTLFP50T3-ND	SMDLTLFP50T3	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Melting Point: 281F (138C) Flux Type: No-Clean Process: Lead Free Form: Jar, 1.76 oz (50g) Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Weight: 0.113 lb (51.26g)	205 Order	1+: $13.2552
DC2010J-10X-ND	DC2010J-10X	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to Plated Through Hole Package Accepted: 2010 Number of Positions: 2 Pitch: 0.185" (4.70mm) Material: FR4 Epoxy Glass Size / Dimension: 0.400" L x 0.200" W (10.16mm x 5.08mm)	96 Order	1+: $3.4713 5+: $3.3806 10+: $3.2886 25+: $3.1974 50+: $3.0146 100+: $2.9232 250+: $2.7405
DC0805J-10X-ND	DC0805J-10X	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to Plated Through Hole Package Accepted: 0805 Number of Positions: 2 Pitch: 0.078" (1.98mm) Material: FR4 Epoxy Glass Size / Dimension: 0.400" L x 0.200" W (10.16mm x 5.08mm)	85 Order	1+: $3.4713 5+: $3.3806 10+: $3.2886 25+: $3.1974 50+: $3.0146 100+: $2.9232 250+: $2.7405
PA0221-ND	PA0221	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TQFP Number of Positions: 128 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.400" x 6.400" (35.56mm x 162.56mm)	1000 Order	1+: $12.9087
SMD291ST8CC-ND	SMD291ST8CC	Chip Quik Inc.	View more Series: CHIPQUIK Part Status: Active Type: Flux - No Clean, Tacky Solder Form: Tube, 0.28 oz (8g), 8cc Shelf Life: 24 Months Shelf Life Start: Date of Manufacture	107 Order	1+: $8.1585
PA0103-S-ND	PA0103-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LGA Number of Positions: 16 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	5 Order	1+: $7.56
PA0106-S-ND	PA0106-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: PLCC/JLCC Number of Positions: 28 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.492" L x 0.492" W (12.50mm x 12.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0229-S-ND	PA0229-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TSOP Number of Positions: 56 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMD291AX50T3-ND	SMD291AX50T3	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Flux Type: No-Clean Process: Leaded Form: Jar, 1.76 oz (50g) Shelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Weight: 0.113 lb (51.26g)	421 Order	1+: $8.1774
CN0030-ND	CN0030	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Connector to SIP Package Accepted: DB9 Number of Positions: 9 Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.400" x 1.200" (10.16mm x 30.48mm)	103 Order	1+: $3.3327
IPC0044-ND	IPC0044	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 40 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)	1000 Order	1+: $7.9317
IPC0005-S-ND	IPC0005-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 14 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm) Thermal Center Pad: 0.081" L x 0.081" W (2.05mm x 2.05mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
FPC050P070-S-ND	FPC050P070-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 70 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm) Thermal Center Pad: 0.157" L x 1.685" W (4.00mm x 42.80mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0016-S-ND	IPC0016-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 28 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.157" L x 0.197" W (4.00mm x 5.00mm) Thermal Center Pad: 0.098" L x 0.138" W (2.50mm x 3.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMD2SW.0311LB-N D	SMD2SW.031 1LB	Chip Quik Inc.	View more Series: SMD2 Part Status: Active Type: Wire Solder Composition: Sn60Pb40 (60/40) Diameter: 0.031" (0.79mm) Melting Point: 361 ~ 370F (183 ~ 188C) Flux Type: No-Clean, Water Soluble Wire Gauge: 20 AWG, 22 SWG Process: Leaded Form: Spool, 1 lb (454 g) Shelf Life: Not Applicable	35 Order	1+: $24.6897 5+: $23.6628 10+: $19.547 25+: $17.4896 50+: $16.4606 100+: $15.4318
PCB3008-1-ND	PCB3008-1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TSSOP Number of Positions: 14 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.400" x 0.700" (10.16mm x 17.78mm)	926 Order	1+: $2.0097
CN0007-ND	CN0007	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Connector to SIP Package Accepted: USB - B Number of Positions: 4 Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)	60 Order	1+: $3.3327
IPC0127-ND	IPC0127	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)	1000 Order	1+: $3.9627
PA0023-S-ND	PA0023-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SSOP Number of Positions: 36 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMD291SNL15T4-N D	SMD291SNL15T4	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste, Two Part Mix Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean Process: Lead Free Form: Jar, 0.53 oz (15g) Shelf Life: 24 Months (Unmixed) Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 77F (3C ~ 25C)	15 Order	1+: $13.1985
SMD291SNL500T5C -ND	SMD291SNL500T5C	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean Process: Lead Free Form: Cartridge, 17.64 oz (500g) Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	1000 Order	1+: $134.996

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