C601106090A06

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C601106090A06 is an acronym for Ceramic Substrates with Electroplated Heavy Metal for Use in VHF/UHF/Microwave Applications. It is an electronics package which typically consists of ceramic substrates with electroplated heavy metal that are used in Very High Frequency (VHF), Ultra High Frequency (UHF) and Microwave applications. The package is designed to provide superior high frequency performance and high immunity from EMI and RFI.C601106090A06 technology has been adopted by a number of the world’s leading semiconductor companies for use in their products. It is a cost-effective and reliable packaging solution for the efficient delivery of ultra high speed electronics.The C601106090A06 package is used in applications that require excellent RF performance and high immunity from EMI and RFI. These applications include RF/IF front-end modules, base station systems, military communication systems, mobile communication systems, consumer electronic products, automotive electronics and other miniature electronic device design.C601106090A06 technology works by electrically connecting the components directly onto the substrate, thus eliminating the need for any external interconnects. This provides a simple and straightforward manufacturing process. The substrate typically consists of two layers of low-loss dielectric material which provides an optimal combination of electrical performance and mechanical strength. Vias are then provided to connect the components to the ground plane. The use of the ground plane minimises the number of discontinuities that are present in the structure which can lead to reduced EMI/RFI radiation.The C601106090A06 package also benefits from the use of Electroplated Heavy Metal (EHM). EHM is a process whereby a thick layer of metal is electroplated onto the surface of the ceramic substrate. This provides an efficient way to bond the components to the substrate while also providing good RF properties. This process also provides a level of protection to the components by shielding them from environmental and mechanical damage.In summary, C601106090A06 is an excellent and affordable package for high frequency applications and a cost-effective and reliable packaging solution for efficient delivery. The package offers superior RF performance, high immunity from EMI and RFI and a straightforward manufacturing process. Additionally, the use of Electroplated Heavy Metal offers excellent RF performance and good thermal stability to the components. This makes C601106090A06 an ideal package for many applications.

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