Allicdata Part #: | CR201-50VE-ND |
Manufacturer Part#: |
CR201-50VE |
Price: | $ 2.59 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Ohmite |
Short Description: | ALUMINUM HEATSINK 50MM DEGREASED |
More Detail: | Heat Sink TO-201 Aluminum Alloy Board Level, Vert... |
DataSheet: | CR201-50VE Datasheet/PDF |
Quantity: | 36 |
1 +: | $ 2.35620 |
10 +: | $ 2.29635 |
25 +: | $ 2.23398 |
50 +: | $ 2.10987 |
100 +: | $ 1.98576 |
250 +: | $ 1.86165 |
500 +: | $ 1.79959 |
1000 +: | $ 1.61343 |
Series: | CR |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-201 |
Attachment Method: | 3 Clips and PC Pin |
Shape: | Rectangular, Fins |
Length: | 1.969" (50.00mm) |
Width: | 2.953" (75.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | -- |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 3.30°C/W |
Material: | Aluminum Alloy |
Material Finish: | Degreased |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are important components in the environment management of many electrical and electronic systems due to their ability to dissipate heat away from sensitive components. The CR201-50VE is a highly efficient and cost-effective thermal heat sink that has been designed and developed for use in a wide variety of applications. In this article, the application field and working principle of the CR201-50VE are discussed.
The CR201-50VE is a thermal heat sink that is designed for use in compact and confined spaces, such as in small electronic appliances, in process control circuits, and in embedded systems. It is a medium size heat sink with a defined area of 50mm x 60mm and is made from an extruded aluminium with a thermal conductivity of 10W/mK. The fin geometry provides a high level of cooling efficiency and ensures that the sink components remain within operating temperatures and remain functional. The CR201-50VE also includes a pre-fitted thermal grease pad to maximise heat transfer between the sink and the component.
The responding application field of the CR201-50VE includes high-end electronic systems which require a reliable and efficient thermal solution. This thermal heat sink is suitable for use in off-grid renewable energy projects, telecommunication, computers, medical electronics, and industrial and institutional controls. It is compatible with many of the components that are used in these systems, such as processors, power transistors, and voltage regulators.
The working principle of the CR201-50VE is based on convection heat transfer. This thermal heat sink is designed to work in various environments in order to dissipate heat away from the component in a safe and efficient manner. The fin geometry of the CR201-50VE is designed to maximise air speed and expose the highest possible surface area for conduction. This greatly enhances the cooling potential of the sink, allowing it to overcome the dissipation restrictions of traditional sinks and dissipate heat more efficiently. The pre-fitted thermal grease effectively transfers the heat from the component to the sink by providing a medium path through which the temperature of the component could be taken away. The thermal performance of the CR201-50VE is affected by the surrounding environment, such as air flow and humidity levels, which need to be monitored in order to ensure maximum cooling efficiency.
In conclusion, the CR201-50VE is a cost-effective, compact thermal heat sink that is designed for operation in confined spaces. It is suitable for use in various applications such as off-grid renewable energy projects, telecommunication, computers, medical electronics, and industrial and institutional controls. Its working principle is based on convection heat transfer and it uses a pre-fitted thermal grease pad to ensure efficient heat transfer away from the component. The environment surrounding the CR201-50VE must be carefully monitored in order to ensure maximum cooling efficiency and the successful operation of the component.
The specific data is subject to PDF, and the above content is for reference
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