ATS-02G-02-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS5414-ND

Manufacturer Part#:

ATS-02G-02-C2-R0

Price: $ 3.69
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X12.7MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02G-02-C2-R0 datasheetATS-02G-02-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.35790
10 +: $ 3.26907
25 +: $ 3.18100
50 +: $ 3.00422
100 +: $ 2.82744
250 +: $ 2.65074
500 +: $ 2.56237
1000 +: $ 2.29730
Stock 1000Can Ship Immediately
$ 3.69
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.32°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important aspect of numerous applications, as reduced heat dissipation allows for higher performance at reduced cost, as well as increased reliability. ATS-02G-02-C2-R0 heat sinks are a type of thermal management system, designed to increase the amount of heat that can be dissipated away from sensors, processors, and other components. In this article, the application field and working principle of the ATS-02G-02-C2-R0 heat sink are discussed.

Applications

ATS-02G-02-C2-R0 heat sinks are typically used in a variety of applications, including:

  • High temperature heat dissipation applications, such as those involving lasers or high-powered lighting.
  • Industrial and consumer electronics, where chipsets and processors need to be cooled.
  • Data centers and storage facilities, where servers need to be kept cool.
  • High-performance computing, where heat dissipation is critical.

ATS-02G-02-C2-R0 heat sinks can also be used in medical and laboratory applications, where reliable and consistent cooling is necessary for accurate results.

Construction

The ATS-02G-02-C2-R0 heat sink is constructed from anodized aluminum, which has excellent thermal conductivity properties. The heat sink also includes integral thin fins that create an increased surface area, allowing for greater volumes of heat to be dissipated. The entire assembly is press-fitted for secure contact with components and features a built-in thermal pad to improve thermal contact. The assembly measures at 140mm x 199mm x 50mm and is designed to be used with various mountings.

Working Principle

The ATS-02G-02-C2-R0 heat sink works by transferring heat away from components using a combination of convection and conduction. The heat is absorbed by the fins of the heat sink, which dissipate the heat into the surrounding environment. This process occurs due to convection, as the heat rises from the fins and dissipates into the surrounding air. Additionally, the anodized aluminum construction of the heat sink also conducts thermal energy away from the components, allowing for improved thermal management.

Conclusion

ATS-02G-02-C2-R0 heat sinks are an effective solution for thermal management, capable of providing increased heat dissipation in a wide range of applications. The heat sink utilizes anodized aluminum construction and thin fins to provide increased levels of convection and conduction, allowing for greater volumes of heat to be safely transferred away from components. As such, the ATS-02G-02-C2-R0 heat sink can provide improved thermal performance in a range of settings.

The specific data is subject to PDF, and the above content is for reference

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