530613B00000G

Series:	--
Part Status:	Active
Type:	Board Level
Package Cooled:	TO-220
Attachment Method:	Bolt On
Shape:	Rectangular, Fins
Length:	1.180" (29.97mm)
Width:	1.000" (25.40mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	4.0W @ 80°C
Thermal Resistance @ Forced Air Flow:	6.00°C/W @ 600 LFM
Thermal Resistance @ Natural:	16.70°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks

Heat sinks are passive devices used to absorb and dissipate heat from a variety of electrical, mechanical or electro-mechanical components. In particular, they are commonly used to cool integrated circuits (ICs) and microprocessor-based systems. While simpler than active cooling systems, heat sinks have become increasingly complex as their use in cooling has expanded. The 530613B00000G is an example of this growing complexity in thermal engineering. This heat sink has a variety of applications and comes with several features that make it a versatile and powerful tool for heat dissipation. The 530613B00000G is a flat-base heat sink which features a groove at the bottom for attaching to peripherals or other mounting devices. The overall size of the heat sink is 80 mm in width by 65mm in length, and it comes with several types of mounting options. It is a black anodized aluminum base heat sink and has five fins that are evenly spaced on the side, providing a great amount of exposed surface area for dissipating heat. It also has the ability to mount to metal housing and is easily adaptable to different enclosures.When it comes to using the 530613B00000G for cooling, it is important to note that different configurations are available which affect the cooling performance. The most common configuration uses a round cover and fan combination. In this configuration, air is forced through the fins and out the top, dispersing the heat generated by the component or device being cooled. Additionally, the 530613B00000G features five additional grooves around the outside of the fin area which allow the mounting of additional cooling fans or all-metal fins. This feature allows for additional cooling to be achieved, depending on the power requirements of the component or device. The 530613B00000G also features a specialized mounting design which allows for the easy assembly and installation of the heat sink. This design consists of two separate parts, the base and a mounting bracket. The base is mounted to the device or component needing thermal dissipation, while the bracket is mounted to a larger peripheral or enclosure. Once the two parts of the assembly are connected, the user can easily attach the fan and round cover, providing additional cooling capability.The 530613B00000G heat sink also has a unique design feature which helps to ensure that it runs at maximum efficiency. This feature is called a thermal baffle and essentially creates a closed loop, which optimizes airflow. This feature works by allowing the air to be drawn from the bottom of the heat sink and then trapped in the fin area before it is expelled out the top. This helps to ensure that all of the heat is drawn away from the component or device, regardless of the orientation or configuration.Overall, the 530613B00000G is a versatile and powerful heat sink that can be used in a variety of applications and with several different configurations. It is designed to provide superior thermal performance, while being relatively simple to mount and install. Additionally, the thermal baffle and variable fan and fin configuration provide maximum cooling efficiency, allowing the user to get the most out of the heat sink.

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