ATS-15B-169-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-15B-169-C1-R0-ND

Manufacturer Part#:

ATS-15B-169-C1-R0

Price: $ 3.24
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X10MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15B-169-C1-R0 datasheetATS-15B-169-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.94273
30 +: $ 2.86335
50 +: $ 2.70434
100 +: $ 2.54520
250 +: $ 2.38614
500 +: $ 2.30659
1000 +: $ 2.06798
Stock 1000Can Ship Immediately
$ 3.24
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.66°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-15B-169-C1-R0 thermal management system is a specialized equipment designed to provide efficient heat transfer from high-heat-generating components to the surrounding environment. Its design incorporates a combination of up to four advanced technologies, including vapor-cooling, air-cooling, plastic-laminated-fins, and a heat-sink.

From a functional standpoint, the key component of the ATS-15B-169-C1-R0 system is the heat-sink. It is a passive item of hardware that works in concert with a temperature-controlled environment to keep components at the optimal operating temperature. In order to do its job, the heat-sink must be designed with a specific thermal transfer ratio that will effectively dissipate the heat produced by the components. This is accomplished through a variety of mechanisms, with each designed to work best in their respective environment. In the ATS-15B-169-C1-R0 system, it employs a combination of the aforementioned vapor-cooling, air-cooling, and plastic-laminated-fins technologies.

Vapor-cooling is the first of these technologies. During this process, the heat-sink is used to turn pressurized steam, generated by an external power source, into a vapor that is then circulated throughout the system. As it passes through the fins of the heat-sink, the vapor absorbs the heat from the components and is expelled from the system. This process quickly, and effectively, exposes the components to a lower temperature than the surrounding environment, allowing them to more efficiently perform their necessary duties.

Air-cooling is the second cooling technology employed. This operates by utilizing vertically placed fans to circulate outside air through the fins of the heat-sink. As the air passes through the fins, the heat from the components is absorbed and dissipated into the outside air. This process is much slower than that of vapor-cooling, but can be highly effective if the outside air is cool enough.

The third cooling technology that the ATS-15B-169-C1-R0 employs is plastic-laminated-fins. This is a variant of vapor-cooling. It functions by utilizing a series of fin-shaped layers of plastic that are laminated together and then sealed to the heat-sink. As compressed air or steam is forced through the fins, the heat is quickly extracted from the components and expelled from the system.

Finally, the last thermal management component of the ATS-15B-169-C1-R0 system is the heat-sink itself. It is an essential tool used to dissipate heat away from the components. There are several different types of heat-sinks available in the market, each of them tailored to a specific application or environment. Some of the more common type is the aluminum, copper, and iron heat-sinks, all of which have their own set of advantages and disadvantages.

In conclusion, the ATS-15B-169-C1-R0 thermal management system is a specialized device that draws heat away from high-heat-generating components. It utilizes a combination of up to four different technologies, including vapor-cooling, air-cooling, plastic-laminated-fins, and a heat-sink to achieve this goal. Its thermal transfer ratio is designed to keep components at their optimal operating temperatures, while simultaneously dissipating the generated heat into the surrounding environment. The ATS-15B-169-C1-R0 system is an invaluable tool for anyone in the market for a reliable and efficient thermal management solution.

The specific data is subject to PDF, and the above content is for reference

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