| Allicdata Part #: | ATS-P1-173-C3-R0-ND |
| Manufacturer Part#: |
ATS-P1-173-C3-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-173-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to transfer and dissipate heat from hot surfaces to cooler air or fluid. Thermal management is an important factor in many electronic applications, as hot spots and high operating temperatures can lead to premature failure and malfunction of electronic components. The ATS-P1-173-C3-R0 is a heat sink designed to manage high temperatures in demanding applications. This article will discuss the application field and working principle of the ATS-P1-173-C3-R0.
Application Field: The ATS-P1-173-C3-R0 is a versatile heat sink designed for use in a variety of applications. It can be used in industrial applications such as electronics cooling, automotive electronics cooling, and telecom equipment cooling. It is also suitable for a wide range of consumer products, including computers, laptops, home theater systems, gaming consoles, and consumer electronics. The ATS-P1-173-C3-R0 is capable of dissipating a large amount of heat in a safe, reliable, and efficient manner.
Working Principle: The ATS-P1-173-C3-R0 heat sink uses a combination of heat transfer technologies to efficiently and safely dissipate heat from hot surfaces. The unit is constructed from high-performance aluminum fins and a heat pipe, which is a sealed copper pipe sealed with Freon gas. The heat pipe is designed to transfer heat from the hot surface into the aluminum fins of the heat sink. The fins then dissipate the heat into the surrounding air, cooling the hot surface.
The ATS-P1-173-C3-R0 is also designed for low noise operation. It is equipped with a fan which, when running, contributes additional cooling power to the heat sink. The fan is designed to run at low speed, which reduces noise while providing efficient cooling performance. The fan is also designed to cycle off when the GPU is not producing heat, allowing the ATS-P1-173-C3-R0 to operate almost silently.
The ATS-P1-173-C3-R0 is designed to meet a variety of thermal management requirements. It is a highly efficient heat sink, designed to produce high cooling capacity in a relatively small size. The unit\'s fan is designed to cycle on and off as needed to provide reliable and efficient cooling performance. The ATS-P1-173-C3-R0 is an ideal heat sink for applications where small cooling capacity and low noise is required.
In conclusion, the ATS-P1-173-C3-R0 is a highly efficient heat sink designed for use in a wide range of applications requiring thermal management. The unit is constructed using a combination of advanced heat transfer technologies and is equipped with a fan for maximized cooling performance. The ATS-P1-173-C3-R0 provides reliable cooling performance in a small size and low noise operation.
The specific data is subject to PDF, and the above content is for reference