Allicdata Part #: | 0077007119-ND |
Manufacturer Part#: |
0077007119 |
Price: | $ 6.83 |
Product Category: | RF/IF and RFID |
Manufacturer: | Laird Technologies EMI |
Short Description: | NOSG,STR,NIB,PSA |
More Detail: | N/A |
DataSheet: | 0077007119 Datasheet/PDF |
Quantity: | 1000 |
100 +: | $ 6.20550 |
Series: | -- |
Part Status: | Active |
Type: | Fingerstock |
Shape: | -- |
Width: | 0.450" (11.43mm) |
Length: | 16.200" (411.48mm) |
Height: | 0.122" (3.10mm) |
Material: | Beryllium Copper |
Plating: | Nickel |
Plating - Thickness: | 299.21µin (7.60µm) |
Attachment Method: | Adhesive |
Operating Temperature: | 121°C |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The contact material 0077007119 is a copper alloy designed for use in RFI and EMI applications. It is a tin-clad copper alloy with a lead-free solderable coating. The material has a high tensile strength and excellent electrical and thermal conductivity. It is used in a wide range of applications, including contacts, fingerstock, and gaskets.
Contacts are designed to transmit and receive electrical signals without causing interference or damage to either component. The 0077007119 contact material is ideal for this application as it is highly conductive and corrosion resistant. The material is also highly compressible and has a soft surface, making it ideal for use in high-density connectors. It is also highly resistant to wear and tear, making it suitable for use in harsh environments.
Fingerstock is used to create electrical contacts between components and a contact surface, such as a printed circuit board. The 0077007119 material is well-suited for this application due to its high electrical and thermal conductivity. The material is also very compressible, allowing for easy installation into tight spaces. The material is also highly resistant to corrosive agents, making it suitable for use in humid environments or in contact with salt water.
Gaskets are used to create a seal between two components, and the 0077007119 material is a common choice. The material is highly compressible and has a soft surface, making it ideal for this application. It is also highly corrosion-resistant, meaning it can stand up to harsh environments. The material\'s high electrical and thermal conductivity make it ideal for applications where a precise temperature control is needed.
The working principle of the 0077007119 contact material is based on its unique composition. The material is made up of a tin-clad copper alloy, which has a lead-free solderable coating. The solder coating acts as an insulator, preventing the transfer of electrical current between components. However, when a pressure is applied to the material, the solder coating deforms and creates a contact between components, allowing electrical current to flow.
The 0077007119 contact material is an excellent choice for use in RFI and EMI applications. The material\'s high electrical and thermal conductivity, corrosion resistance, and compressibility make it ideal for use in a wide range of applications, including contacts, fingerstock, and gaskets.
The specific data is subject to PDF, and the above content is for reference
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8N3DV85LC-0077CDI | IDT, Integra... | 12.14 $ | 1000 | IC OSC VCXO DUAL FREQ 6-C... |
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8N3Q001LG-0077CDI8 | IDT, Integra... | 12.8 $ | 1000 | IC OSC CLOCK QD FREQ 10CL... |
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GK NICU PTAFG PU V0 DSH
NOSG,STR,SNB,PSA
CLO,STR,ZNY,DLN
GK NICU NRSG PU V0 SQ
MILCONNECTOR,ECE050 1.50X1.75X1.
GK SNCU NRS PU V0 JSH