0078001502 Allicdata Electronics
Allicdata Part #:

0078001502-ND

Manufacturer Part#:

0078001502

Price: $ 0.32
Product Category:

RF/IF and RFID

Manufacturer: Laird Technologies EMI
Short Description: SLMT,1F,BF,USFT
More Detail: N/A
DataSheet: 0078001502 datasheet0078001502 Datasheet/PDF
Quantity: 1000
1000 +: $ 0.28995
Stock 1000Can Ship Immediately
$ 0.32
Specifications
Series: Slot Mount
Part Status: Active
Type: Fingerstock
Shape: --
Width: 0.600" (15.24mm)
Length: 0.250" (6.35mm)
Height: 0.220" (5.59mm)
Material: Beryllium Copper
Plating: --
Plating - Thickness: --
Attachment Method: Slot
Operating Temperature: 121°C
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Radio Frequency Interference (RFI) and Electromagnetic Interference (EMI) are of great concern in the modern tech-driven world. Contacts, fingerstock and gaskets are essential to the containment, prevention and control of these interferences. A number of materials are available to ensure optimal performance for contacts, fingerstock and gaskets in RFI/EMI applications, the 0078001502 being one such reliable option.

The 0078001502 material is a copper-nickel alloy with silver added for fusing. Nickel provides the alloy with additional hardness and improved corrosion resistance compared to pure copper. Silver has been added to give the material greater conductivity, allowing maximum current capability which is important in high frequency applications. This material is especially designed to perform in high frequency applications, where minimal resistance is necessary for transmitting radio frequencies.

The 0078001502 material can be applied in a range of RFI/EMI applications, the most prominent being electrical contacts and fingerstock gaskets. Electrical contacts are often used in electrical equipment such as transformers and power circuits. The use of high frequency applications has grown exponentially over the last few years due to the explosion of technological progress and digital communication systems, all of which continues to expand the capacity that needs to be catered for. In this context, electrical contacts offer the perfect option to deliver long lasting reliable performance, ensuring the efficient operation of these systems.

The ability of 0078001502 to effectively dissipate RFI/EMI is especially important when designing contact assemblies. This material has the ability to block high frequency signals due to its ability to reduce or eliminate contact resistance. In turn, this ensures that signal integrity is not compromised. Furthermore, the material eliminates the need for traceable grounding, further helping to save cost and speed up production.

In addition to contact applications, the 0078001502 material is also used for fingerstock gaskets. Fingerstock gaskets are designed to improve the contact performance and provide screen shielding. The 0078001502 material has the ability to absorb noise generated by connectors and cabling, and can also be used to shield electronic components from surrounding interference. This material is often used in portable and wireless applications where continuous or near continuous communication is required. Overall, this material is designed to provide increased power integrity and create an effective barrier against any destructive ground noise interference.

The 0078001502 material is an ideal choice for any RFI/EMI application due to its superior electrical and mechanical properties. It offers excellent electrical conductivity, superior corrosion resistance and excellent mechanical strength. This ensures that the material is able to provide long lasting reliable performance in demanding environments. In addition, this material is relatively low cost when compared to other materials, making it an excellent value for money.

In conclusion, the 0078001502 material is a reliable option for RFI/EMI Contacts, Fingerstock and Gaskets applications. Its superior electrical and mechanical performance, in combination with its cost-effectiveness, make it an ideal choice for high-frequency applications and the prevention of ground noise interference. This material has been specifically designed to improve contact performance and provide a shield for electronic components, while providing increased power integrity and reduced resistance.

The specific data is subject to PDF, and the above content is for reference

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