0098055547 RF/IF and RFID |
|
Allicdata Part #: | 0098055547-ND |
Manufacturer Part#: |
0098055547 |
Price: | $ 9.51 |
Product Category: | RF/IF and RFID |
Manufacturer: | Laird Technologies EMI |
Short Description: | TWT,STR,SNB,USFT |
More Detail: | N/A |
DataSheet: | 0098055547 Datasheet/PDF |
Quantity: | 1000 |
100 +: | $ 8.64892 |
Series: | Twist |
Part Status: | Active |
Type: | Fingerstock |
Shape: | -- |
Width: | 0.340" (8.64mm) |
Length: | 24.000" (609.60mm) |
Height: | 0.070" (1.78mm) |
Material: | Beryllium Copper |
Plating: | -- |
Plating - Thickness: | -- |
Attachment Method: | Adhesive |
Operating Temperature: | 121°C |
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The ability to interact with the surrounding environment is an essential aspect of many electronic and electrical circuits. From a design perspective, the use of specialized contacts, fingerstock, and gaskets can be instrumental in ensuring reliable and consistent interfacing between components. This article will examine 0098055547 application field and working principle in the realm of RFI and EMI (Radio Frequency Interference and Electromagnetic Interference) shielding.
The utilization of contact, fingerstock, and gasket materials represents a critical factor in reducing the transmission of RFI and EMI signals within, and between, electronic components. Generally speaking, contact and fingerstock materials are comprised of conductive, inductive or magnetic elements, which establish electrical continuity between two or more points. In many cases, the contact and fingerstock materials are designed to provide a tight fit between various components to limit the degree to which radiation and interferences are able to bridge the gap between them. Likewise, the design of the gasket materials used can help prevent the movement of air (and, thereby, the transmission of RFI and EMI signals).
The 0098055547 is an example of the contact and fingerstock materials used in RFI and EMI shielding applications. This material is a highly conductive copper alloy, featuring a single-layer, non-bonded structure with a unique design that prevents dislocation and breakage during installation. Additionally, the 0098055547’s soft temper allows for the establishment of a secure and lasting electrical connection between components. In order to facilitate better contact with adjacent components, the molding process is also designed to maintain a uniform height from one side of the contact to the other.
The 0098055547 also integrates a special gasket material which prevents the movement of air, sealed between ground planes. This, in turn, helps to maintain continuity within the device and prevents the transmission of air-borne signals. Additionally, the 0098055547 utilizes a solid barrier of metal, which prevents the movement of heat or light through the opening, further reducing the transmission of RFI and EMI signals.
In the realm of EMI and RFI shielding, the 0098055547 has become an essential tool in the design of electronic devices. Utilizing the unique combination of contact and fingerstock materials, in conjunction with the gasket materials, is instrumental in ensuring continuity between components and preventing the transmission of unwanted RFI and EMI signals. As a result, these materials offer excellent performance and reliability when used in a variety of application fields.
The specific data is subject to PDF, and the above content is for reference
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