0098060602 Allicdata Electronics
Allicdata Part #:

0098060602-ND

Manufacturer Part#:

0098060602

Price: $ 8.29
Product Category:

RF/IF and RFID

Manufacturer: Laird Technologies EMI
Short Description: CLO,STR,DLN,BF,USF
More Detail: N/A
DataSheet: 0098060602 datasheet0098060602 Datasheet/PDF
Quantity: 1000
100 +: $ 7.53011
Stock 1000Can Ship Immediately
$ 8.29
Specifications
Series: Clip-On
Part Status: Active
Type: Fingerstock
Shape: --
Width: 0.380" (9.65mm)
Length: 16.000" (406.40mm)
Height: 0.200" (5.08mm)
Material: Beryllium Copper
Plating: --
Plating - Thickness: --
Attachment Method: Clip
Operating Temperature: 121°C
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

In the realm of RFI and EMI - Contacts, Fingerstock, and Gaskets, 098060602 has a variety of applications and working principles. At its core, the 098060602 is a device designed to bridge the gap between dissimilar materials. This allows for a great degree of flexibility when applied in different scenarios, from the strictly mechanical to the more electronic.

The most common example of its application is in the manufacturing of connectors and gaskets. Connectors are pieces of hardware that are used to connect two conveniently separated parts in order to establish connection and promote interaction. Engineers use 098060602 in order to secure the connection between connectors. Such security is essential in order to ensure the most optimal performance of their device, both in terms of EMI and RFI shielding. Additionally, 098060602 is also used in the production of gaskets (sealing applications) by supporting the adhesive layer and improving insulation levels and the overall durability of the gasket.

But that is by no means the only application of the 098060602. It also sees implentation in more mechanical projects, such as the reinforcement of metal or plastic parts, and - thanks to its insulation properties - it can also provide additional protection for electronic components or circuits.

Moving onto its working principle, which is based on the concept of a template layer. This layer is integrated into the 098060602 and serves as the base to precisely define the dimension of the materials that the device is placed between. This definition allows the material to remain snug and connected at all times, thus providing a connection that is both reliable and strong.

The adhesive layer mentioned earlier also plays a role in the working principle of the 098060602. Its purpose is twofold; both to increase the conductivity between the materials connected by the device and to act as an additional reinforcement. 202060602 also functions as a cushion between the two materials, preventing abrasion and other physical damage that could otherwise occur during operation.

As we have seen today, 098060602 provides a highly versatile device and has multiple applications in the field of RFI and EMI. Its working principle, based on the template as well as adhesive layers, ensures a secure and reliable connection between the materials it bridges.

The specific data is subject to PDF, and the above content is for reference

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