0365070075 Allicdata Electronics
Allicdata Part #:

0365070075-ND

Manufacturer Part#:

0365070075

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Molex, LLC
Short Description: ASSEMBLY DIN 41612 B MALE 64 POS
More Detail: N/A
DataSheet: 0365070075 datasheet0365070075 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: 36507
Packaging: --
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Connector Type: Header, Male Pins
Number of Positions: --
Number of Positions Loaded: --
Pitch: --
Style: --
Mounting Type: --
Termination: --
Features: --
Contact Finish: --
Contact Finish Thickness: --
Operating Temperature: --
Current Rating: --
Material Flammability Rating: --
Material - Insulation: --
Description

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Backplane Connectors - DIN 41612

The 0365070075 backplane connector provides signal and power contacts in a single connector, giving superior performance and reliability. It is a multi-layer interconnect connector that is designed for use in direct current (DC) applications in the telecommunications, aerospace, automotive and industrial markets. It is commonly used in backplanes for multi-layer boards.

The unique design of the 0365070075 backplane connector gives it high contact density (36 pins per row) and a wide variety of wire-termination options. Connector materials and configuration options provide superior signal and power performance far superior to standard IC packages. With its long-term reliability and durability, the 0365070075 backplane connector is an ideal choice for use in mission-critical applications.

The 0365070075 backplane connectors have a high-density contact arrangement. This allows flexibility in design and allows for increased packing density over other connector designs. The contact pins are arranged in two rows with eighteen pins each. The contact length and pitch are .200 inch and .100 inch, respectively. This ensures reliable connection throughout the life of the device.

The 0365070075 backplane connector is designed for use in applications where a robust and reliable connection is required. It is rated for up to 18 amps of power contact, and up to 40 amps of signal contact. With its high contact density and wide array of wire termination options, it is ideal for a variety of applications, such as telecommunications, aerospace, automotive and industrial environments.

The 0365070075 backplane connector has a unique working principle which differentiates it from other connector designs. It combines the advantages of a board-to-board connector, a board-to-wire connector, and a wire-to-wire connector. The entire design utilizes a common pin-and-socket assembly, which allows for flexibility in design while maintaining reliability. This means that it can be used to connect multiple boards and/or wires. The pins can be configured to have a different number of contacts to accommodate different board configurations.

The 0365070075 backplane connector is used in a variety of application fields. In telecommunications, it is used for multi-layer boards of telecom equipment and data communication systems. In automotive applications, it is used for racks and boards for automotive electronics. In aerospace, it is used in aircraft systems for control, communications, and sensing. In industrial applications, it is used for backplanes of control and automation systems, distributed I/O, and embedded computing systems.

The 0365070075 backplane connector is an example of a reliable and robust high-density connector suitable for a variety of applications. Its multiple contact design and flexible pin configuration make it an ideal choice for applications that require a reliable connection with a wide variety of wire termination options. With its robust design and high contact density, the 0365070075 is an excellent choice for use in mission-critical applications.

The specific data is subject to PDF, and the above content is for reference

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