06033J3R7BAWTR

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Thin Film Capacitors

Thin film capacitors consist of two conducting electrodes separated by a thin dielectric layer. The dielectric layer can be made of an oxide, nitride, or polysilicon compound. Thin film capacitor technology has seen extensive use in a wide range of capacitor applications, including arrays of capacitors in a single package and multi-layer chip packages for AC applications. Examples of thin film capacitor technology are 06033J3R7BAWTR.

06033J3R7BAWTR Application Field and Working Principle

06033J3R7BAWTR is a thick-film, low-temperature co-fired ceramic (LTCC) multilayer capacitor with a capacitance of 7.5 pF and a maximum SRF of 350 GHz. It is designed to be used in RF and microwave circuits where a high frequency performance is required, such as communication systems, filter networks, and active matching circuits. The technology used enables the production of miniature components – which increases circuit density – while maintaining the performance of thicker-film devices.

The 06033J3R7BAWTR has two terminals, one is the one-side ground plate and the other is the variable capacitor plate which has the ceramic dielectric material deposited between conductors. When a voltage is applied to the variable plate, the dielectric material will break down and act as an insulator, thus allowing or blocking the flow of current. This is the concept of capacitance, which is the measure of a capacitor\'s ability to store energy when exposed to a voltage.

The 06033J3R7BAWTR offers a high power rating and excellent overall RF performance in a compact package. The dielectric material used is tailored to provide high dielectric constants along with low losses, thus delivering extremely high frequency performance. The capacitor also has a low temperature coefficient which makes it ideal for use in high temperature applications.

In addition to its high power rating, the 06033J3R7BAWTR provides excellent overall RF performance and reliability under the most demanding conditions. It has been designed to meet safety agency guidelines and has been certified for use in demanding applications. The chip packages feature excellent solderability and provide protection against mechanical shock and vibration.

The 06033J3R7BAWTR is an excellent choice for applications that require high power and RF performance. Its high power rating and low temperature coefficient make it ideal for high temperature applications and its compact package provides an advantage in circuit design. The chip packages provide excellent reliability and safety and have been certified for use in demanding applications.

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