0761653804

Series:	Impact™ 76165
Packaging:	Tray
Lead Free Status / RoHS Status:	--
Part Status:	Active
Moisture Sensitivity Level (MSL):	--
Connector Usage:	--
Connector Type:	Header, Male Pins
Connector Style:	Impact™, Guide Left
Number of Positions:	72
Number of Positions Loaded:	All
Pitch:	0.053" (1.35mm)
Number of Rows:	9
Number of Columns:	8
Mounting Type:	Through Hole
Termination:	Press-Fit
Contact Layout, Typical:	24 Differential Pairs
Features:	--
Contact Finish:	Gold
Contact Finish Thickness:	30.0µin (0.76µm)
Color:	Black
Current Rating:	--
Material Flammability Rating:	UL94 V-0
Operating Temperature:	-55°C ~ 85°C
Voltage Rating:	30V

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

0761653804 Application Field and Working Principle

Backplane connectors are a type of interconnect which is used to interconnect multiple printed circuit boards. They achieve this by using two level lamination, which is essential when using modern circuit boards. The 0761653804 is an example of a very specific backplane connector which is used to provide high-speed lamination, while simultaneously keeping board-to-board distances between 0.3mm and 0.5mm.

Application Field

The 0761653804 backplane connector is mainly used in applications which require low latency and high signal integrity, such as in transfer link communication systems. It has a proven track record of success in these fields, as it is able to achieve a very high level of transmission performance even in challenging environments. As such, it is an ideal choice for use in high-speed data centers, as well as any other field where very fast transmission speeds are required.

Working Principle

The 0761653804 has a unique working principle which combines both high-speed lamination and board-to-board contact. The connector is made of a special laminated substrate which is capable of connecting multiple boards at a very close scale. The lamination process works by first positioning the two planes to be laminated at a fixed distance. Then, the lamination occurs through two etch-resistant layers which form a very tight bond. The etch-resistant layers are able to keep very small clearances between the two boards which is essential for a successful high-speed lamination process.Once the lamination process has been completed, the contact between the two boards is made possible through a number of contact pads which have the ability to make very fast and reliable connections. These contact pads are designed to maintain a low contact resistance which helps to ensure high-speed signal integrity. Additionally, the contact pads are also able to provide a good electrical contact which reduces the risk of signal attenuation or interference.Overall, the 0761653804 is a highly effective backplane connector which is ideal for use in applications which require high levels of data transmission. It is capable of achieving a very fast lamination process, while simultaneously providing a reliable connection between the two boards. Additionally, the contact pads are able to ensure a low contact resistance and good electrical contact which is essential for ensuring data integrity.

The specific data is subject to PDF, and the above content is for reference

Part Number	Manufacturer	Price	Quantity	Description