09030006250

Backplane connectors, also known as printed circuit board connectors, are used to interconnect two or more printed circuit boards (PCBs) in various electronic applications. Backplane connectors are designed to efficiently and reliably transfer a signal or power from one PCB to another. These connectors are commonly used in networking, aerospace, computing, telecom and automotive applications.

09030006250 is a backplane contact manufactured by TE Connectivity. It is suitable for use in 0.8mm glass filled thermoplastic board stiffener. This contact is designed with a straight pin and solder tail for superior electrical performance and board-to-board, multi-dimensional design flexibility. The contact length is 2.00mm and the contact body style is a high-temperature profile.

The 09030006250 has a maximum working voltage of 300V and a maximum recommended operating temperature of 105 degrees Celsius. It is designed to be reliable in dynamic flexural and compression applications. In addition, the contact is designed to transmit signal data and power to and from the PCBs without spending too much energy.

The 09030006250 is designed with an insulated metal contact design. This allows the contact to reliably connect and transfer power and signal while preventing arcing and short-circuiting. In addition, the contact’s insulation means it can be used in applications requiring a wide voltage range. Furthermore, the contact has a strong vibration resistance, which ensures reliable operation in dynamic and demanding applications.

The contact is also designed to be low profile and easily integrated into PCB’s and other electronic components. The contact is made of a high-temperature insulation material, which provides superior temperature performance. With its low profile design, the 09030006250 contact can simplify board-level connection requirements while preserving the signal integrity of the data.

In conclusion, the 09030006250 is a reliable and efficient backplane contact suitable for use in various kinds of electronic applications. It has a straight pin and solder tail construction that enhances the transmission of signals and power from one board to the next. Additionally, it has a strong vibration resistance and is designed with high-temperature insulation materials to ensure superior temperature performance. Most importantly, its low profile design simplifies the board-level connections and preserves data integrity.