0C97052019 Allicdata Electronics

0C97052019 RF/IF and RFID

Allicdata Part #:

0C97052019-ND

Manufacturer Part#:

0C97052019

Price: $ 7.19
Product Category:

RF/IF and RFID

Manufacturer: Laird Technologies EMI
Short Description: AP COIL NIB PSA
More Detail: N/A
DataSheet: 0C97052019 datasheet0C97052019 Datasheet/PDF
Quantity: 1000
250 +: $ 6.53121
Stock 1000Can Ship Immediately
$ 7.19
Specifications
Series: All-Purpose
Part Status: Active
Type: Fingerstock
Shape: --
Width: 0.370" (9.40mm)
Length: 16.000" (406.40mm)
Height: 0.140" (3.56mm)
Material: Beryllium Copper
Plating: Nickel
Plating - Thickness: 299.21µin (7.60µm)
Attachment Method: Adhesive
Operating Temperature: 121°C
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The technology of 0C97052019 in the field of RFI and EMI - Contacts, Fingerstock and Gaskets has been in use for many years. This technology has become increasingly popular as it provides an easy, cost-effective and reliable way of protecting electronic devices from electromagnetic interference (EMI) and radio frequency interference (RFI). 0C97052019 is a very versatile technology that can be used for a wide variety of applications.

In terms of its application, 0C97052019 is most commonly used for applications where EMI and RFI control is critical. It is typically used to provide a conductive path between the contact and fingerstock, allowing signals to pass between the two. The conductive path is created by using a number of layers of contact pads, with each layer having a specific width and contact shape. The contacts are then connected to each other via a conductive material such as copper or silver foil, which provides AC/DC current conduction. The current flow is then reduced to the necessary level by controlling the voltage and current through the layers.

The principle behind the technology of 0C97052019 is based on the concept of "dielectric barrier". In essence, a dielectric barrier is a layer of insulating material that prevents the passage of EMI or RF signals. It works by creating a physical barrier between the contact and the fingerstock, which prevents the passage of any signal or noise from one side to the other. This effectively eliminates the possibility of interference or distortion, thus ensuring reliable and high-quality performance.

0C97052019 can also be used in various other applications as well. It can be used inside and around electronic devices, shielded enclosures and other sensitive equipment. It is also used to provide a conductive path for signals between different components in a circuit, including logic gates, transistors and capacitors. In addition, it can be used to reduce power leakage and to provide impedance control.

0C97052019 is a versatile technology that is widely used in many applications. It is rather easy to use and relatively inexpensive compared to other EMI and EMF control technologies. It provides a secure and reliable connection between contacts and fingerstock that ensures an efficient transmission of signals between the two. As such, 0C97052019 is an invaluable tool in the field of RFI and EMI - Contacts, Fingerstock and Gaskets and is an essential part of any electronic device or system.

The specific data is subject to PDF, and the above content is for reference

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